a welding method

A welding method and welding liquid technology, which are applied in welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of complex process, more scum generation, and no environmental protection, and achieve a simple process, less scum, and easy operation. Effect

Inactive Publication Date: 2015-09-02
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0020] In order to overcome the problem that the welding method in the prior art produces a lot of scum, the process is complicated, and it is not environmentally friendly, the present invention provides a welding method that produces less scum, and the process is simple and safe, and produces less waste gas such as carbon dioxide. Conducive to environmental protection

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • a welding method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0067] This embodiment is used to illustrate the welding method disclosed in the present invention.

[0068] Add 27 parts by weight of phytic acid and 35 parts by weight of nonylphenol polyoxyethylene ether to 3 parts by weight of ammonium metaphosphate at 90°C, and then stir at 70°C for 30 minutes. Add 35 parts by weight of nonylphenol polyoxyethylene ether and stir for 30 minutes. A reducing agent composition S1 is obtained.

[0069] In the solder pool of the wave soldering machine, melt tin-silver-copper alloy solder (96.5% Sn, 3% Ag, 0.5% Cu) at 275°C, and then add reducing agent composition S1 to form a solder with the above composition on the surface of the molten solder The reduced layer, began to wave solder the printed circuit board.

Embodiment 2

[0071] This embodiment is used to illustrate the welding method disclosed in the present invention.

[0072] Add 3 parts by weight of ammonium dihydrogen phosphate to 3 parts by weight of ammonium metaphosphate at 90°C, then add 24 parts by weight of phytic acid and 50 parts by weight of nonylphenol polyoxyethylene ether, and then stir at 70°C for 40 minutes. Add 20 parts by weight of nonylphenol polyoxyethylene ether and stir for 40 minutes. A reducing agent composition S2 is obtained.

[0073] In the solder pool of the wave soldering machine, melt tin-silver-copper alloy solder (96.5% Sn, 3% Ag, 0.5% Cu) at 275°C, and then add reducing agent composition S2 to form on the surface of the molten solder. The reduced layer, began to wave solder the printed circuit board.

Embodiment 3

[0075] This embodiment is used to illustrate the welding method disclosed in the present invention.

[0076] Add 15 parts by weight of citric acid and 50 parts by weight of nonylphenol polyoxyethylene ether to 5 parts by weight of ammonium metaphosphate at 100°C, and then stir at 90°C for 10 min. Add 30 parts by weight of nonylphenol polyoxyethylene ether and stir for 15 minutes. A reducing agent composition S3 is obtained.

[0077] In the solder pool of the wave soldering machine, melt the tin-silver-copper alloy solder (96.5% Sn, 3% Ag, 0.5% Cu) at 275°C, and then add the reducing agent composition S3 to form the above-mentioned composition on the surface of the molten solder The reduced layer, began to wave solder the printed circuit board.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a welding method, which comprises the following steps of: forming molten solder in a solder pool; forming a soldering fluid flow which is higher than the surface of the molten solder from the molten solder; and contacting an object to be welded with the soldering fluid flow to perform welding, wherein a reducing layer is arranged on the surface of the molten solder, the welding temperature is 240-280 DEG C, and the concentration of CO2 at a place just above the liquid level of the reducing layer is less than 560 mg / m<3>. According to the welding method, less scum is produced, the process is simple and safe, less waste gas such as carbon dioxide is produced, and environmental protection is facilitated.

Description

technical field [0001] The invention relates to a welding method, in particular to a through-hole welding method. Background technique [0002] In industrial production, it often involves the process of melting a metal or alloy to combine or adhere to another metal. Since most metals will be oxidized in contact with oxygen, such as tin slag (SnO and SnO) produced in a static tin furnace or a dynamic wave furnace 2 ) is one of the most common examples of metal oxidation in industry. In a high-temperature environment, especially in a molten state, the oxidation of the metal (or alloy) will be more severe, and a layer of oxide will soon be formed, and the more it gathers. In the process of adhesion and bonding of molten metal and other metals, the molten metal must be continuously flowed and circulated, which will intensify the oxidation rate on the one hand, and on the other hand mean that the oxides on the surface and a small amount of oxygen will be brought to the liquid s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): B23K1/00
Inventor 严永农
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap