Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A hybrid production process for a printing stencil used in surface-mounting technology (SMT)

A surface mount technology and manufacturing process technology, applied in the field of material manufacturing and processing, to achieve the effect of high position accuracy, smooth hole wall, less burrs or burrs

Inactive Publication Date: 2013-07-17
KUN SHAN POWER STENCIL
View PDF3 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The production problem of the up step and down step of the template lies in the precise grasp of its thickness and position accuracy. For the up step with graphic openings, the position accuracy requirements are even higher, and the difficulty can be imagined

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A hybrid production process for a printing stencil used in surface-mounting technology (SMT)
  • A hybrid production process for a printing stencil used in surface-mounting technology (SMT)
  • A hybrid production process for a printing stencil used in surface-mounting technology (SMT)

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0072] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0073] The specific technological process of this legal name and the attention problem in technological process among the present invention will be more detailed in the following narration.

[0074] A hybrid manufacturing method for step formwork. Its specific technological process is as follows:

[0075]Fabrication of the convex PCB surface and the concave area of ​​the printed surface:

[0076] (1) Substrate processing: Select stainless steel as the substrate material, and cut the substrate into the required size.

[0077] (2) Pre-t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A hybrid production process for a printing stencil used in surface-mounting technology (SMT). The process flow is as follows: the fabrication of the up step area on a PCB surface and the down step area on a printing surface: substrate processing -> pretreatment (degreasing and pickling) -> double sided film mounting -> PCB surface exposure -> printing surface exposure -> double sided developing -> double sided etching; and the fabrication of the openings of the stencil: printing surface laser cutting. A metal stencil having the PCB surface with up steps, and the printing surface with down steps can be produced by using the process. According to the metal stencil produced by using the process, the openings of the substrate pattern area and the up step pattern area have good quality, smooth hole walls and no phenomena of blurs or slag; the surface of the metal stencil is good in quality and flat, the opening areas thereof without phenomena of protruding deformation; and the position precision of the pattern opening area of the up steps with the opening area of the substrate is high.

Description

technical field [0001] The invention relates to a mixed production process of a surface mount technology (SMT) printing template, which belongs to the field of material manufacturing and processing, and specifically relates to a PCB surface with raised steps in the SMT field, and a printed surface with concave steps, and on the PCB. A manufacturing process of a mask plate for printing with graphic openings on the surface, the printing surface and the plane area. [0002] Background technique [0003] With the pursuit of miniaturization of electronic products, the perforated plug-in components used before can no longer be reduced; the functions of electronic products are more complete, and the integrated circuits (ICs) used can no longer perforate components, especially large-scale and highly integrated ICs, which have to use surface SMT components, so the stencil printing process has developed rapidly in the electronics manufacturing industry, and SMT printing is a typical ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B41C1/14
Inventor 魏志凌高小平赵录军王峰
Owner KUN SHAN POWER STENCIL
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com