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A kind of manufacturing process of step formwork

A manufacturing process and step technology, applied in the field of step template preparation technology, can solve the problems of high energy consumption, high cost, rough spots, etc., and achieve the effects of high position accuracy, good opening quality, and smooth hole walls.

Inactive Publication Date: 2016-12-14
KUN SHAN POWER STENCIL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the opening precision of the steel mold made by the traditional technology through laser cutting technology cannot meet the requirements, and the quality of the board surface is not high enough.
However, the electroformed nickel mask is easy to form pinholes and rough spots on the surface of the plate, and the solution is unstable, high cost, and high energy consumption.

Method used

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  • A kind of manufacturing process of step formwork
  • A kind of manufacturing process of step formwork
  • A kind of manufacturing process of step formwork

Examples

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Embodiment Construction

[0055] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0056] The specific technological process of this legal name and the attention problem in technological process among the present invention will be more detailed in the following narration.

[0057] The invention discloses a manufacturing process of a step formwork. This kind of step template is prepared by a mixed preparation process, including etching and laser cutting processes. The specific process flow is as follows:

[0058] (1) Substrate processing: select stainless steel as the substrate material, and cut the substrate into the ...

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Abstract

A production process of a step stencil. The production process flow is as follows: substrate processing (cutting) ->pre-treatment (degreasing, pickling, and sandblasting) -> film mounting -> double sided exposure -> double sided developing-> etching (a printing surface with up steps) -> film stripping -> pre-treatment (degreasing and pickling) -> laser cutting (openings of flat openings and up steps). The process includes etching and laser cutting steps, and a metal stencil having a printing surface with up steps can be produced by using the process. The metal stencil produced by using the process has a high position alignment precision of the pattern opening of the area of up steps with a substrate opening; walls of opening holes of the overall stencil are smooth and straight and without undesirable phenomena of burrs or jags, etc.; the metal stencil has good surface quality and no undesirable defects of deformation, whitening, etc.; and the COV of the board thickness uniformity is less than10%.

Description

technical field [0001] The invention relates to a preparation process of a stepped template, which belongs to the field of material manufacturing and processing, and specifically relates to a printing mask in the field of SMT with raised steps (up steps) on the printing surface and opening patterns in the raised step area. Mixed preparation process of the template. Background technique [0002] With the rapid development of my country's electronics industry, stencil printing technology has also been applied in the electronics manufacturing industry, and SMT printing is a typical example. In the manufacturing process of electronic products, soldering electronic components and PCB needs to put tin on the PCB first, and there are hundreds of pads on the PCB that need to be tinned. The position of each pad corresponds to the electronic component. The best way to accurately tin the pads that need to be tinned at one time is to print. The usual method used in the electronics man...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41C1/12B41N1/04B41N3/03G03F7/00
Inventor 魏志凌高小平王峰孙倩
Owner KUN SHAN POWER STENCIL
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