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Low-temperature resistant hot melt adhesive and processing technology thereof

A technology of low-temperature heat and melt adhesive, applied in the direction of adhesives, monocarboxylate copolymer adhesives, adhesive types, etc., can solve the problem of narrow temperature range, avoid product purification, simple and stable process, avoid The effect of solvent recovery

Inactive Publication Date: 2013-06-26
HONGSHANG HEAT SHRINKABLE MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage is that the temperature range is narrow, only resistant to low temperatures of -20°C

Method used

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  • Low-temperature resistant hot melt adhesive and processing technology thereof
  • Low-temperature resistant hot melt adhesive and processing technology thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Embodiment one: high melting point dimer acid type polyamide resin (trade name dimer acid YH-17, purchased from Yuanda Chemical Group (Guangzhou) Branch 50g), ethylene vinyl acetate (trade name EVA220, purchased from Mitsui Corporation of Japan ) 10g, ethylene vinyl acetate (trade name EVA450, purchased from Mitsui Corporation, Japan) 10g, ethylene acrylate maleic anhydride terpolymer (trade name 6200, purchased from ARKEMA Lotader) 5g, terpene resin (trade name T100, Purchased from Yoshida Chemical Co., Ltd.) 22g, antioxidant (model 1010) 1g, antioxidant (model 1098) 1g, antioxidant (model 802) 0.5g, polyethylene wax 0.5g, add twin-screw extrusion Mixing is carried out in the machine, the mixing temperature is 140°C, and the mixing is done twice, and the high melting point polyamide hot melt adhesive product is obtained by using circulating water to cool the hob and pelletize. The softening point of this product is 152°C and the viscosity is 150,000mpa. .s.

Embodiment 2

[0038] Embodiment 2: high melting point dimer acid type polyamide resin (softening point 120 ℃, trade name LR-DLB-120, purchased from Shanghai Liri Chemical New Material Co., Ltd.) 40g, ethylene vinyl acetate (trade name EEA210, purchased from From Mitsui Corporation of Japan) 10g, ethylene vinyl acetate (trade name VA920, purchased from Korea Hyundai Petrochemical Company) 20g, ethylene acrylate maleic anhydride terpolymer (trade name 8200, purchased from ARKEMA Lotader) 1g, carbon five Hydrogenated petroleum resin (trade name C-100W, purchased from Nanjing Eastman) 26g, antioxidant (model 1010) 1g, antioxidant (model 1098) 1g, antioxidant (model 802) 0.5g 1. Polyethylene wax 0.5g, all the materials were added into the twin-screw extruder for mixing, the mixing temperature was 120°C, mixed twice, and the high melting point polyamide hot melt adhesive was obtained by using circulating water to cool the hob and cut into pellets The product has a softening point of 120°C and a v...

Embodiment 3

[0039] Example 3: 50 g of high melting point dimer acid type polyamide resin (softening point 140° C., trade name LR-DLB-150, purchased from Shanghai Liri Chemical New Material Co., Ltd.), ethylene vinyl acetate (trade name EEA210, purchase From Mitsui Corporation of Japan) 20g, ethylene vinyl acetate (trade name EVA930, purchased from Korea Hyundai Petrochemical Company) 10g, ethylene acrylate maleic anhydride terpolymer (trade name 8200, purchased from ARKEMALotader) 1g, terpene resin (trade name T100, purchased from Yoshida Chemical Co., Ltd.) 16g, antioxidant (model 1010) 1g, antioxidant (model 1098) 1g, antioxidant (model 802) 0.5g, polyethylene wax 0.5g , all the materials are put into the twin-screw extruder for mixing, the mixing temperature is 120°C, and the mixing is done twice, and the high melting point polyamide hot melt adhesive product is obtained by using circulating water to cool the hob and pelletize. The point is 145°C, and the viscosity is 144000mpa.s.

[...

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Abstract

The invention provides low-temperature resistant hot melt adhesive and a processing technology of the low-temperature resistant hot melt adhesive. The low-temperature resistant hot melt adhesive comprises the following components: polyamide, an ethylene vinyl acetate copolymer, an ethylene-acrylate-maleic anhydride terpolymer, wax, tackifying resin and an antioxidant. The low-temperature resistant hot melt adhesive is high in adhesive strength, excellent in insulating seal performance, environmentally-friendly, nontoxic, simple in production technology and high in repeatability, and is mainly applicable to places requiring high low-temperature performance.

Description

technical field [0001] The invention relates to a low-temperature-resistant hot-melt adhesive, which is mainly suitable for environments with high requirements on low-temperature performance. The invention also relates to the processing technology of the low temperature resistant hot melt adhesive. Background technique [0002] my country has a vast territory, four distinct seasons, and large temperature differences between regions and seasons. The low temperature resistance of hot melt adhesives is directly related to the safety of use in different seasons and regions, and whether hot melt adhesives have a wider range of use. Under the cold climate conditions in the north, if the hot melt adhesive has poor low temperature resistance, it is prone to brittle cracks, which directly affects the bonding effect of the hot melt adhesive. [0003] Chinese patent CN201010233746.9, titled "a low-temperature-resistant hot-melt adhesive", uses ethylene-vinyl acetate copolymer, thermo...

Claims

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Application Information

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IPC IPC(8): C09J177/00C09J177/06C09J177/02C09J131/04C09J123/08
Inventor 钟晓光曾婉张晓伟
Owner HONGSHANG HEAT SHRINKABLE MATERIALS
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