TiCuN nano composite coating and preparation method thereof
A nanocomposite coating and transition layer technology, applied in the coating, metal material coating process, ion implantation plating, etc., to achieve the effects of improving hardness and fracture toughness, refining grain size, and reducing friction coefficient
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Embodiment 1
[0025] Plating transition layer: the substrate is made of high-speed steel (grade W18Cr4V), the size of the sample is 20mm×10mm×10mm, and the size of the coating surface is 20mm×10mm. The surface before coating is ground, polished, ultrasonically cleaned and dried, and then placed on the sample stage of the vacuum chamber until the vacuum degree in the vacuum chamber reaches 5×10 -3 At Pa, heat the vacuum chamber to 400oC, feed argon gas into the vacuum chamber, set the gas flow rate to 100sccm, control the air pressure at 2.0Pa, apply pulse negative bias voltage -800V to the substrate, and perform glow cleaning on the sample for 10 minutes; then , adjust the flow rate of argon gas to adjust the pressure of the vacuum chamber to 0.5Pa, and at the same time turn on the titanium-copper alloy target arc source, the arc flow is stable at 70A, and perform Ti on the sample + and Cu + Bombard for 5 minutes; adjust pulse negative bias to -300V, deposit TiCu film for 3 minutes;
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Embodiment 2
[0029] The substrate is made of cemented carbide (grade YG6), the size of the sample is 20mm×10mm×10mm, and the size of the coated surface is 20mm×10mm. The surface before coating is ground, polished, ultrasonically cleaned and dried, and then placed on the sample stage of the vacuum chamber until the vacuum degree in the vacuum chamber reaches 4×10 -3 At Pa, turn on the gas mass flow controller, pass argon gas to 1.0 Pa, apply pulse negative bias to -600V on the substrate, and perform glow cleaning on the sample for 8 minutes; then, adjust the flow rate of argon gas to adjust the pressure of the vacuum chamber to 0.6Pa, turn on the titanium-copper target arc source at the same time, the arc current is stable at 80A, and perform Ti on the sample + and Cu + Ion bombardment for 5 minutes; adjust the pulse negative bias to -400V, and deposit the TiCu metal layer for 3 minutes; after that, enter the deposition process of the TiCuN layer, first stop argon and feed nitrogen, adjust...
Embodiment 3
[0032] The substrate is made of high-speed steel (grade W6Mo5Cr4V2Al), the size of the sample is 20mm×10mm×10mm, and the size of the coated surface is 20mm×10mm. The surface before coating is ground, polished, ultrasonically cleaned and dried, and then placed on the sample stage of the vacuum chamber until the vacuum degree in the vacuum chamber reaches 3×10 -3 At Pa, pass argon gas to 1.0Pa, apply pulse negative bias to -500V on the substrate, and perform glow cleaning on the sample for 5 minutes; then, adjust the Ar gas flow rate to adjust the vacuum chamber pressure to 0.3Pa, and open the titanium copper target at the same time Arc source, the arc current is stable at 80A, Ti + and Cu + Ion bombardment for 4 minutes; adjust the pulse negative bias to -500V, and deposit the TiCu metal layer for 3 minutes; after that, enter the deposition process of the TiCuN layer, first stop argon and feed nitrogen, adjust the air pressure to 0.4Pa; adjust the substrate pulse negative bias...
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