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Multilayer printed board lamination method

A multi-layer printed board and board layer technology, applied in the field of printed board manufacturing, can solve problems such as the inability of multi-layer printed boards to meet the needs of technological development, and achieve the goal of improving flatness and improving the pass rate. Effect

Active Publication Date: 2013-06-12
SHANTOU ULTRASONIC PRINTED BOARD NO 2 FACTORY
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AI Technical Summary

Problems solved by technology

Although the above method can meet the general requirements, it cannot meet the short, small, light, and thin quality requirements of high-grade, high-precision multilayer printed boards. Many assembly manufacturers have already required multilayer printed boards. The warpage is less than 0.5%, especially electronic products such as smart touch screen mobile phones have stricter requirements on the warpage of multilayer printed boards
Therefore, the existing lamination technology has been unable to meet the ever-changing technical development needs on this issue.

Method used

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Embodiment Construction

[0027] Further description will be given below in conjunction with the accompanying drawings and preferred embodiments of the present invention.

[0028] Such as figure 1 As shown, this multilayer printed board lamination method includes the following steps:

[0029] (1) Calculate the warpage degree of the general warpage produced by the multilayer printed board in the case of straight board lamination, and the warpage degree is calculated as follows: the multilayer printed board using the straight board lamination method For calculating the warpage of the sample, the sample is placed on the platform with the protruding side of the sample facing up, the warpage of the sample = R / L, where R is the maximum vertical distance between the sample and the platform, and L is the opposite angle of the sample contacting the platform line length;

[0030] (2) According to the calculated degree of warpage, set warpage guide plates 1 of various specifications. The warpage guide plate 1 i...

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Abstract

The invention relates to a multilayer printed board lamination method. When the multilayer printed board carries out a high-temperature lamination, a warping guiding board leads the multilayer printed board to carry out compulsory warping in a direction opposite to an original warping direction through the arrangement of two warping guiding boards. After cooling and annealing, the multilayer printed board still carries out warping in the original warping direction because of the asymmetric structural features and internal stress of the multilayer printed board, however, the compulsory warping generated by the warping guiding board plays an balanced role, and the warping degree of the multilayer printed board is far smaller than that of the general warping ( under the circumstances of adopting straight board lamination, warping generated by the multilayer printed board). Therefore, the multilayer printed board lamination method can substantially improve glancing flatness of the multilayer printed board after being laminated, improve the qualification rate of products, and the problem that in the prior art, the warping of the multilayer printed board is influenced by the aging of a hot tray is solved.

Description

technical field [0001] The invention relates to a method for manufacturing a printed board, in particular to a method for laminating a multilayer printed board. Background technique [0002] With the development of electronic technology, high speed, multi-function, large capacity and low consumption are the development direction of electronic products. The application of multi-layer printed boards is becoming more and more extensive, and the number of layers and density are getting higher and higher. The structure is also becoming more and more complex. [0003] The so-called multi-layer printed board is a printed board formed by alternately laminating and bonding more than three layers of conductive pattern layers and insulating material layers, and achieves the interlayer conductive pattern interconnection specified by the design requirements. It has the characteristics of high assembly density, small size, light weight, and high reliability. It is a type of printed circu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
Inventor 何润宏邱彦佳许灿源辜小谨林辉
Owner SHANTOU ULTRASONIC PRINTED BOARD NO 2 FACTORY
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