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A kind of fluorescent glue and the technology of using fluorescent glue to encapsulate white light LED

A fluorescent glue and glue sealing technology, which is applied in the field of fluorescent glue, can solve problems affecting the brightness of LED lamps and white light output of LEDs, and achieve the effects of improving product quality, increasing output, and increasing brightness

Active Publication Date: 2016-08-10
SHANGHAI ADVANCED SILICON TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The process of encapsulating LEDs generally requires steps such as solid crystal, wire bonding, dispensing, and baking. The fluorescent glue used in the existing process of encapsulating white LEDs is to add phosphor powder to silica gel. This packaging process is due to the phosphor Precipitation is too fast, which will affect the white light output of the LED and affect the brightness of the LED lamp

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A process for encapsulating white light LEDs with fluorescent glue, comprising the following steps:

[0020] a. Set the LED chip on the bracket, and then bake, the baking temperature is 130°C, and the baking time is 0.5 hours;

[0021] b. Carry out wire welding;

[0022] c. According to the weight ratio of A agent 1: B agent 0.5: fluorescent powder 0.075: nano anti-precipitation powder 0.045, select fluorescent glue, stir the fluorescent glue, and stir for two stages. The stirring speed of the first stage is 1300 rpm seconds, the stirring time is 200 seconds; the stirring speed of the second stage is 700 rpm, the stirring time is 250 seconds, and then fluorescent glue is applied;

[0023] d. Bake the LEDs that have been dotted with fluorescent glue. The baking is divided into three stages. The baking temperature of the first stage is 50°C, and the baking time is 0.5 hours; The baking time is 0.5 hours, the third-level baking temperature is 160°C, and the baking time i...

Embodiment 2

[0027] Preferably, the weight ratio of the A agent, B agent, fluorescent powder and nano anti-sedimentation powder is 1:0.5:0.15:0.075.

[0028] A process for encapsulating white light LEDs with fluorescent glue, comprising the following steps:

[0029] a. Set the LED chip on the bracket, and then bake, the baking temperature is 140°C, and the baking time is 0.5 hours;

[0030] b. Carry out wire welding;

[0031] c. According to the weight ratio of A agent 1: B agent 0.5: fluorescent powder 0.15: nano anti-precipitation powder 0.075, select fluorescent glue, stir the fluorescent glue, and stir for two stages. The stirring speed of the first stage is 1500 rpm seconds, the stirring time is 200 seconds; the stirring speed of the second stage is 700 rpm, the stirring time is 250 seconds, and then fluorescent glue is applied;

[0032] d. Bake the LEDs that have been dotted with fluorescent glue. The baking is divided into three stages. The baking temperature of the first stage is...

Embodiment 3

[0035] A process for encapsulating white light LEDs with fluorescent glue, comprising the following steps:

[0036] a. Set the LED chip on the bracket, and then bake, the baking temperature is 150°C, and the baking time is 0.5 hours;

[0037] b. Carry out wire welding;

[0038] c. According to the weight ratio of A agent 1: B agent 0.5: fluorescent powder 0.3: nano anti-precipitation powder 0.15, select fluorescent glue, stir the fluorescent glue, and stir for two stages. The stirring speed of the first stage is 1400 rpm seconds, the stirring time is 200 seconds; the stirring speed of the second stage is 700 rpm, the stirring time is 250 seconds, and then fluorescent glue is applied;

[0039] d. Bake the LEDs that have been dotted with fluorescent glue. The baking is divided into three stages. The baking temperature of the first stage is 55°C, and the baking time is 0.5 hours; The baking time is 0.5 hours, the third-level baking temperature is 155°C, and the baking time is 4...

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PUM

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Abstract

The invention relates to fluorescent glue and a process of packaging a white light LED (light-emitting diode) by the same. The fluorescent glue comprises silica gel, fluorescent powder and nano anti-precipitating powder. The silica gel includes agent A and agent B. The weight ratio among the agent A, the agent B, the fluorescent powder and the nano anti-precipitating powder is 1: 0.5: (0.075-0.3): (0.045-0.15). Since the nano anti-precipitating powder is added into the fluorescent powder, precipitation speed of the fluorescent powder can be effectively controlled, output of white light of an LED can be increased, luminance of the LED can be improved, and product quality of the LED can be improved, as compared with those of traditional fluorescent glue.

Description

technical field [0001] The invention relates to a fluorescent glue and a process for encapsulating a white LED with the fluorescent glue, in particular to a fluorescent glue for improving the white light output of the LED and a process for encapsulating the white LED with the fluorescent glue. Background technique [0002] Light-emitting diode is a solid-state semiconductor device that can directly convert electrical energy into light energy. It has the advantages of high luminous efficiency, low power consumption, fast response, small size, long life, vibration resistance, and suitable for mass production. With the development of science and technology, LED technology is more and more widely used in people's daily life, such as various LED lamps and LED display screens. [0003] The process of encapsulating LEDs generally requires steps such as solid crystal, wire bonding, dispensing, and baking. The fluorescent glue used in the existing process of encapsulating white LEDs ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/50
Inventor 袁红宇
Owner SHANGHAI ADVANCED SILICON TECH CO LTD
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