Cooling module and assembling method thereof

Abstract

The invention relates to a cooling module and an assembling method thereof. The assembling method comprises arranging a first thermally-conductive medium in receiving grooves of a plurality of cooling fins, with a heat pipe penetrating the plurality of cooling fins and arranged in the receiving grooves; heating the cooling fins and the heat pipe, as so to enable the heat pipe to be combined with the receiving grooves of the cooling fins through a first thermally-conductive medium and then enable a flat part of the heat pipe to attach to heating elements; and arranging a second thermally-conductive medium between the heating elements and the flat part, so that the heat pipe, the heating elements and the second thermally-conductive medium contact with each other, thereby forming the cooling module. Through directly attaching the flat part of the heat pipe to the heating elements, component number of the cooling module can be reduced, and thus transfer ways of heat can be reduced, thereby improving cooling efficiency of the cooling module.

Description

【Technical field】 [0001] The present invention relates to a heat dissipation module and an assembly method thereof, in particular to a heat dissipation module in which a heat pipe is directly attached to a heat generating component and an assembly method thereof. 【Background technique】 [0002] see figure 1 , which is a structural schematic diagram of a heat dissipation module installed on a heat generating component in the prior art. [0003] As shown in the figure, the heat dissipation module 100 of the prior art is mounted on a heat generating component 200, wherein the heat dissipation module 100 of the prior art includes a plurality of heat dissipation fins 110, a plurality of heat pipes 130 and a module base 150, the heat dissipation fins 110 is provided with a plurality of accommodating grooves 112, the heat pipe 130 is arranged in the accommodating groove 112, a first heat conduction medium 120 is arranged between the accommodating groove 112 and the heat pipe 130, ...

AI Technical Summary

Problems solved by technology

[0006] It can be seen that there are many heat transfer paths in the heat dissipation module of the conventional technology, and between each transfer path, the contact surfaces between the components may not be completely flat due to the unevenness of the contact surfaces. Therefore, it will increase the thermal resistance between two adjacent components, which will seriously affect the heat transfer efficiency. In addition, there are many conventional transfer paths, so the heat dissipation efficiency of the heat dissipation module will be reduced.

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