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Glass powder for electronic paste and preparation method thereof

A technology of electronic paste and glass powder, which is applied in the field of glass powder for electronic paste and its preparation, which can solve the problems of increased melting temperature and softening temperature, decreased chemical stability and wettability, and mismatched expansion coefficients. , to achieve the effects of lower melting temperature, improved chemical stability and wettability, and increased expansion coefficient

Active Publication Date: 2015-01-07
SUZHOU BETELY POLYMER MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Most of the properties of the above-mentioned lead-free glass powders have reached or approached the level of traditional glass powders on various substrates or applications, but there are still a series of problems, such as chemical stability and wettability decrease, fusing temperature and Increased softening temperature, mismatch of expansion coefficients, etc. More importantly, the melting temperature of glass powder is high, mostly above 1200°C, and there are many components, and the process is time-consuming, which increases the cost

Method used

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  • Glass powder for electronic paste and preparation method thereof
  • Glass powder for electronic paste and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] The preparation method of the glass powder for the electronic paste of the present embodiment is as follows:

[0030] S1. Weigh 7.2g SiO with an electronic platform scale 2 , 0.9g Al 2 o 3 , 0.9g MgO, put into ceramic mortar and grind, mix;

[0031] S2. Weigh 231g Bi respectively 2 o 3 , 9g ZnO, 48g B 2 o 3, together with the mixed material powder obtained in step S1, put into a stainless steel basin with a capacity of 5L and mix;

[0032] S3. Move the mixed initial material obtained in step S2 into a ceramic crucible with a capacity of 200ml, put it into a muffle furnace, and melt it at 1050°C for 10 minutes, then take out the molten glass and pour it into pure glass at room temperature (about 25°C). Water quenching is carried out in water, and the product after water quenching is collected and dried in an oven at 90°C for 5 hours;

[0033] S4. The material obtained in step S3 is rolled into granules with a twin-roll mill, and then ball milled for 30min at a sp...

Embodiment 2

[0037] The preparation method of the glass powder for the electronic paste of the present embodiment is as follows:

[0038] S1. Weigh 7.2g SiO with an electronic platform scale 2 , 0.9g Al 2 o 3 , 0.9g MgO, put into ceramic mortar and grind, mix;

[0039] S2. Weigh 231g Bi respectively 2 o 3 , 15g ZnO, 42g B 2 o 3 , together with the mixed material powder obtained in step S1, put into a stainless steel basin with a capacity of 5L and mix;

[0040] S3. Move the mixed initial material obtained in step S2 into a ceramic crucible with a capacity of 200ml, put it into a muffle furnace, and melt it at 1040°C for 10 minutes, then take out the molten glass and pour it into pure glass at room temperature (about 25°C). Water quenching is carried out in water, and the product after water quenching is collected and dried in an oven at 90°C for 5 hours;

[0041] S4. The material obtained in step S3 is rolled into granules with a twin-roll mill, and then ball milled for 30min at a ...

Embodiment 3

[0045] The preparation method of the glass powder for the electronic paste of the present embodiment is as follows:

[0046] S1. Weigh 7.2g SiO with an electronic platform scale 2 , 0.9g Al 2 o 3 , 0.9g MgO, put into ceramic mortar and grind, mix;

[0047] S2. Weigh 231g Bi respectively 2 o 3 , 21g ZnO, 39g B 2 o 3 , together with the mixed material powder obtained in step S1, put into a stainless steel basin with a capacity of 5L and mix;

[0048] S3. Move the mixed initial material obtained in step S2 into a ceramic crucible with a capacity of 200ml, put it into a muffle furnace, and melt it at 1030°C for 18 minutes, then take out the molten glass and pour it into pure glass at room temperature (about 25°C). Water quenching is carried out in water, and the product after water quenching is collected and dried in an oven at 90°C for 5 hours;

[0049] S4. The material obtained in step S3 is rolled into granules with a twin-roll mill, and then ball milled for 30min at a ...

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Abstract

The invention relates to the technical field of lead-free glass powder and a preparation method thereof and in particular relates to glass powder for electronic paste and the preparation method thereof. The glass powder for the electronic paste comprises the following components in percentage by weight: 76-82% of Bi2O3, 3-8% of ZnO, 11-18% of B2O3, 1-4% of SiO2, 0.1-0.4% of Al2O3 and 0.1-0.4% of MgO. According to the glass powder for electronic paste, the Bi2O3 is adopted to replace PbO, the glass powder does not contain matters such as lead and cadmium which are harmful for human health and environments and has very strong adaptability for high-temperature lead-free soldering; the chemical stability and wetting property are improved, the expansion factor is increased, and meanwhile, the thermal sealing temperature and the softening temperature are lowered; and the glass powder can be taken as a bonding phase of the electronic paste, and the production cost is greatly lowered. After the produced lead-free glass powder is ground and uniformly mixed with metal powder, additives and organic vehicles and is printed on a substrate of a ceramic capacitor by utilizing silk-screen printing to form a conduction electrode, the lead-free glass powder has excellent adhesive force, weldability and electrical conductivity with the substrate. The preparation method for the glass powder provided by the invention has the advantages of simple preparation process, convenience in operation and low cost.

Description

technical field [0001] The invention relates to the technical field of lead-free glass powder and a preparation method thereof, and more particularly relates to a glass powder for electronic paste and a preparation method thereof. Background technique [0002] The traditional glass frit used in silver electronic paste contains many harmful substances such as lead and cadmium, and its soldering temperature is about 230°C. On July 1, 2006, the European Union's "Restriction of Hazardous Substances Directive" (Restriction of Hazardous Substances) began to be formally implemented. This standard is mainly used to regulate the material and process standards of electronic and electrical products, so that It is more beneficial to human health and environmental protection. The purpose of this standard is to eliminate harmful substances such as lead and cadmium in electrical and electronic products. So far, reducing the amount of harmful substances such as lead and cadmium in silver ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C12/00
Inventor 资定红张樱
Owner SUZHOU BETELY POLYMER MATERIALS CO LTD
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