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Power connector

A technology for power connectors and docking parts, applied in base/housing, cooling/ventilation/heating transformation, etc., can solve interference (such as static interference, electromagnetic wave interference, impedance matching, affecting the performance and safety of the whole system, hot air It is not easy to solve problems such as increasing heat dissipation, improving safety, and increasing current flow.

Inactive Publication Date: 2013-05-15
ACES ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Press, the design of connectors in electronic circuits usually pays special attention to the two basic signal and power parts, and when designing signal circuits, because the current flowing in signal circuits is usually low, designers usually do not consider the Current changes in electrical properties, but in the signal circuit part due to different transmission changes (such as high-frequency, low-frequency transmission, etc.), signal interference (such as static interference, electromagnetic wave interference, impedance matching, etc.) needs to be considered, but it is The temperature change will not be considered, and the power circuit part is related to the higher current conduction state, so the electrical properties of the power circuit will change the temperature due to the impedance generated by the high current. Therefore, for the use in the power circuit The power connector designed in must be able to have better heat dissipation characteristics and reduce the impedance generated by the terminals conducting high current, so that the changes in electrical characteristics caused by high current changes can be minimized, and the terminals of the power connector The size of the contact area and the heat dissipation area will affect the quality of power transmission. However, this type of power connector is mostly used on power supplies and server equipment, and is connected to the circuit board. The metal shrapnel that conducts power Due to the impedance generated by the input of high current, it will cause temperature rise, heat generation, etc., which will affect the system performance and safety of the whole machine
[0003] see Figure 8 As shown, it is a three-dimensional appearance view of a known power connector seat body. It can be clearly seen from the figure that one side of the plastic body A has a butt joint A1, and a butt joint A1 is provided on the butt joint A1 for at least one terminal B to pass through. The docking space A10 is set, and the docking part A1 is cut with a plurality of through holes A11 connected to the docking space A10. When the terminal B is transmitting power, the high heat generated by the terminal B can pass through the docking part A1. The plurality of through-holes A11 communicate with the outside to dissipate heat, but since the gap between the docking space A10 of the docking part A1 and the circuit board will become quite narrow after docking, the hot air inside the docking part A1 is difficult to pass through the plurality of through-holes A11 is dissipated to the outside, so that the high heat generated by terminal B cannot effectively circulate with the outside air to assist in heat dissipation

Method used

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Embodiment Construction

[0033] The technical means and structure adopted by the present invention are described in detail with reference to the preferred embodiments of the present invention, and its features and functions are as follows in order to facilitate a complete understanding.

[0034] see figure 1 , figure 2 , image 3 As shown, they are the three-dimensional appearance diagram, the three-dimensional exploded view and the three-dimensional exploded view of another perspective of the present invention. It can be clearly seen from the figure that the present invention includes a seat body 1 and a plurality of terminals 2, wherein:

[0035] The seat body 1 has at least one docking portion 11 and a plurality of partition plates 12 extending behind the docking portion 11, and at least one accommodating groove 121 is formed between the partition plates 12, and the docking portion 11 is provided with a The docking space 110 of the opening 1101, and the opening 1101 is connected to each accommo...

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Abstract

Provided is a power connector. The power connector comprises a seat body, a plural number of terminals and a heat dissipation mechanism, wherein the seat body is provided with an abutting-joint portion, a plural number of spaced boards and containing grooves, wherein the back portion of the abutting-joint portion extends to from the plural number of spaced boards, the containing grooves are formed among the spaced boards, each containing groove is provided with the plural number of terminals in a penetrating mode, the terminals are used for positioning, an abutting-joint end is arranged on one side of a board body, a welding portion extends from the other side of the board body, at least one caulking groove is formed outside the abutting-joint portion, the heat dissipation mechanism is provided with at least a metal sheet body, the metal sheet body is covered on the abutting-joint portion in a positioning mode, a positioned buckle which can be clamped into the caulking groove in an embedded mode is arranged on the metal sheet body, the number of the heat dissipation mechanism can be increased to increase heat dissipation areas according to actual demands, and is beneficial for improvement of heat dissipation effects, magnitude of currents which can be loaded at the same temperature rise can be wholly improved, and thus smooth power conduction can be achieved, and use safety can be improved.

Description

technical field [0001] The invention provides a power connector, especially a power connector that can effectively reduce impedance and temperature. Background technique [0002] Press, the design of connectors in electronic circuits usually pays special attention to the two basic signal and power parts, and when designing signal circuits, because the current flowing in signal circuits is usually low, designers usually do not consider the Current changes in electrical properties, but in the signal circuit part due to different transmission changes (such as high-frequency, low-frequency transmission, etc.), signal interference (such as static interference, electromagnetic wave interference, impedance matching, etc.) needs to be considered, but it is The temperature change will not be considered, and the power circuit part is related to the higher current conduction state, so the electrical properties of the power circuit will change the temperature due to the impedance genera...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R13/46H05K7/20
Inventor 秦咸宁段浩然
Owner ACES ELECTRONICS CO LTD
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