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A production process of optimizing the secondary plastic package by widening the false cavity of the mold

A secondary plastic packaging and manufacturing process technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of product reliability and packaging dissatisfaction, increased feed inlet height, and high cost of plastic packaging materials. Achieve the effect of improving reliability, increasing the force area, and facilitating flow

Active Publication Date: 2017-12-26
HUATIAN TECH XIAN
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the above-mentioned shortcomings, and provide a manufacturing process for optimizing the secondary plastic sealing package by widening the false cavity of the mold. High cost and limited selection range of plastic encapsulants, product reliability and encapsulation dissatisfaction

Method used

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  • A production process of optimizing the secondary plastic package by widening the false cavity of the mold
  • A production process of optimizing the secondary plastic package by widening the false cavity of the mold
  • A production process of optimizing the secondary plastic package by widening the false cavity of the mold

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Embodiment Construction

[0024] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0025] A manufacturing process for optimizing a secondary plastic package by widening the false cavity of the mold, which is carried out according to the following steps:

[0026] The first step, half-etching of the lead frame: Etch the lead frame 8 through mature gluing, exposure, development, electroplating and corrosion processes, etch the carrier, I / O pad pins on the frame, and determine the I / O soldering Pad pin size, pin spacing and their respective locations; as figure 1 shown;

[0027] The second step, core loading: the chip 10 is bonded to the carrier of the lead frame 8 with the adhesive 9; figure 2 shown;

[0028] The third step, pressure welding: the solder joint 11 on the chip is connected with the pin of lead frame 8 with bonding wire 12; image 3 shown;

[0029] The fourth step, one-time plastic sealing: automatically transfer the pressur...

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Abstract

The invention discloses a production process for optimizing a secondary plastic packaging package by widening the false mold cavity of a mold. The production process is carried out according to the following steps: frame half-etching, core loading, pressure welding, primary plastic sealing, secondary etching, and ball planting , film, secondary plastic sealing, film removal, cutting and separation. In the secondary plastic sealing, the width of the false cavity and the height of the feed port of the mold are increased, which can adapt to a wider range of plastic sealing materials, improve the reliability of the secondary plastic sealing of products, and facilitate the flow of plastic sealing materials.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a manufacturing process for optimizing a secondary plastic packaging package by using a widened mold false cavity. Background technique [0002] With the continuous development of technology, electronic packaging must not only provide chip protection, but also meet the increasing requirements of performance, reliability, heat dissipation, power distribution, etc. at a certain cost, which puts forward new requirements and requirements for packaging technology. challenge. Fierce market competition promotes the continuous progress of packaging technology, and plastic packaging, as one of the key links in semiconductor packaging technology, has also developed from primary plastic packaging to secondary plastic packaging. The quality of the plastic packaging process directly affects product reliability, cost, and performance And other issues. [0003] The current sec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56
CPCH01L2224/48091H01L2224/73265
Inventor 李涛涛谌世广王虎马晓波钟环清
Owner HUATIAN TECH XIAN
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