Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Halogen-free low dielectric epoxy resin composition

A technology of epoxy resin and composition, which is applied in the field of epoxy resin composition of laminates, can solve the problems of poor heat resistance and poor processability, and achieve the effects of low dielectric constant, high heat resistance and increased toughness

Inactive Publication Date: 2013-05-01
VENTEC ELECTRONICS SUZHOU
View PDF4 Cites 15 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The laminate made of the SMA / DCPD epoxy resin composition mentioned in patent CN102372900A has a Dk above 4.1, while the SMA / non-DCPD epoxy resin composition mentioned in other patents has the problem of poor processability or poor heat resistance

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Halogen-free low dielectric epoxy resin composition
  • Halogen-free low dielectric epoxy resin composition
  • Halogen-free low dielectric epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] The following are specific examples of the present invention to further describe the present invention, but the present invention is not limited to these examples.

[0031] The sources of all raw material components in the following examples are shown in Table 1, and the formulations of the epoxy resin compositions of Examples 1-6 are shown in Table 2.

[0032] Table 1

[0033]

[0034] Table 2

[0035]

[0036] The copper clad substrate is prepared through the following steps in sequence:

[0037] (1) Prepare the glue solution according to the formula in Table 2: add the components of the formula amount into the batching container at about 40°C, and stir evenly;

[0038] (2) Gluing: Bake the adhesive cloth soaked in the above glue (i.e. electronic grade fiber glass cloth) in an oven to make a prepreg, the baking temperature is 200-300°C, and the prepreg gluing speed is 8-12m / min;

[0039] (3) Hot pressing: After combining the cut prepreg and the electrolytic c...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A halogen-free low dielectric epoxy resin composition comprises epoxy resin, a curing agent and a curing promoter, wherein the epoxy resin consists of 80-100 parts by weight of dicyclopentadiene epoxy resin and 0-20 parts by weight of bisphenols A epoxy resin, counted in terms of 100 parts by weight of epoxy resin; the content of the curing agent is 20-60 parts by weight; and the curing agent is alkyl-modified phenolic resin. The curing agent is introduced to generate cross-linking reaction with the epoxy resin, so that a dielectric coefficient and a dielectric loss factor are remarkably reduced. The halogen-free low dielectric epoxy resin composition is suitable for manufacturing a laminated board used by a high-frequency circuit. In addition, no halogen elements are contained in the components of the composition, so that the pollution to the environment is avoided.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to an epoxy resin composition with a relatively low dielectric constant, which is suitable for making laminated boards used in high-frequency circuits. Background technique [0002] With the rapid development of modern electronic technology in recent years, the volume of electronic products has developed towards miniaturization and multi-function, and the signals between circuits are transmitted at very high speed, especially in high-frequency communication fields such as radio frequency base stations and radar antennas (2GHz and above) , the problems of signal delay and transmission loss urgently need to be solved. Since the degree of signal delay is proportional to the square root of the dielectric constant of the insulator on the circuit board, and the transmission loss is proportional to the dielectric constant (Dk) and dielectric loss factor (Df) of the insulator on the circuit boa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/02C08K9/06C08K3/36C08G59/62B32B15/092
Inventor 钟健人王琢邹水平
Owner VENTEC ELECTRONICS SUZHOU
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com