Halogen-free low-splash solder wire and preparation method of halogen-free low-splash solder wire

A solder wire and solder technology, applied in welding equipment, welding medium, manufacturing tools, etc., can solve the problems of welding efficiency tin wire splashing, smoke and dust harm to human body, etc., and achieve the effect of improving welding efficiency, low odor, and improving splash characteristics.

Inactive Publication Date: 2014-12-10
JIANGSU UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the problems of halogen existing in the above-mentioned existing tin wire flux, the harm of smoke and dust in the welding process to the human body, the problem of welding efficiency and the problem of splashing of tin wire, and provide a performance-standard, green and environmentally friendly non-toxic Halogen low spatter solder wire and preparation method thereof

Method used

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  • Halogen-free low-splash solder wire and preparation method of halogen-free low-splash solder wire
  • Halogen-free low-splash solder wire and preparation method of halogen-free low-splash solder wire
  • Halogen-free low-splash solder wire and preparation method of halogen-free low-splash solder wire

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Solder wire ratio: flux 2%, Sn-3.0Ag-0.5Cu rod (φ100mm) solder 98%

[0027] Among them, the flux mass percentage ratio is: 35% hydropine, 35% polymerized rosin, 12% rubber, 2% benzotriazole, 2% methylimidazole, 0.5% oxalic acid, 3% oxalate, Succinic acid 3%, antioxidant oil 3%, compound AK218 active agent 4.5%.

[0028] Preparation:

[0029] Step 1. Flux preparation: evenly heat the rosin in the flux formula to 170±5°C. After it is completely melted, add the rest of the flux materials and stir until all the materials are dissolved and the appearance is uniform and clear liquid. The heating time cannot exceed 120±5 minutes, otherwise the flux will not be used. Filter after heating, filter the heated and melted solder paste with a 100-mesh filter and pour it into the flux barrel of the wire extruder to keep it warm at 90-100°C, and the air pressure setting range is 0.1-0.4MPa;

[0030] Step 2. Extrusion: install the selected rod-shaped solder on the extruder, set the e...

Embodiment 2

[0034] Tin wire ratio: flux 1.8%, Sn-0.7Cu rod (φ100mm) solder 98.2%

[0035] Among them, the flux mass percentage ratio is: 32% hydrogenated rosin, 35% polymerized rosin, 15% rubber, 2% phenylacryltriazole, 2% ethylimidazole, 1.5% oxalic acid, 3% oxalate, Succinic acid 3%, antioxidant oil 3%, compound AK218 active agent 3.5%;

[0036] No small pull is needed in the preparation method, and others are the same as in Example 1.

[0037] The various test indexes of the solder wire obtained in this embodiment are shown in Table 1 and Table 2. Compared with Example 1, due to the increase of the formula rubber content, the surface insulation resistance after welding is improved.

Embodiment 3

[0039] Tin wire ratio: flux 2%, Sn-0.3Ag-0.7Cu rod (φ100mm) solder 98%

[0040] Among them, the flux mass percentage ratio is: 32% of hydrogenated rosin, 31% of polymerized rosin, 19% of rubber, 2% of benzotriazole, 2% of ethylimidazole, 1.5% of oxalic acid, 3% of oxalate, Succinic acid 3%, antioxidant oil 3%, compound AK218 active agent 3.5%;

[0041] No small pull is needed in the preparation method, and others are the same as in Example 1.

[0042] The various test indicators of the solder wire obtained in this embodiment are shown in Table 1 and Table 2, and its splash effect is as follows: figure 2 shown.

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Abstract

The invention discloses a halogen-free low-splash solder wire and a preparation method of the halogen-free low-splash solder wire. The halogen-free low-splash solder wire comprises the following ingredients in percentage by mass: 97.4 percent to 98.2 percent of welding fluxes and 1.8 to 2.6 percent of soldering fluxes, wherein the welding fluxes are selected from one of materials including Sn-0.7Cu, Sn-3.0Ag-0.5Cu and Sn-0.3Ag-0.7Cu, and the soldering fluxes consist of the following ingredients in percentage by mass: 12 to 22 percent of rubber, 6.5 to 8.5 percent of organic acid, 2 percent of benzotriazole, 2 percent of imidazole substances, 3 percent of oxidation resistant oil, 3.5 to 4.5 percent of composite active agents and the balance of rosin. The preparation method is characterized in that firstly, the soldering fluxes are prepared according to the proportion, and then, the solder wire is obtained through work procedures of wire extrusion, wire pulling and wire winding. The characteristic indexes of the solder wire respectively meet the requirements of JIS-Z-3197 and IPC-TM-650 standards. After the welding, welding spots are bright and full, the odor is low, the splash is little, and green and environment-friendly effects are realized.

Description

technical field [0001] The invention belongs to the technical field of electronic welding materials, relates to a solder wire, and more particularly relates to a halogen-free low-splash solder wire and a preparation method thereof. The solder wire meets the requirements of REACH38 and RoHS6, and the performance index of the solder wire meets the relevant standards of IPC and JIZ. Background technique [0002] The current electronic packaging industry has basically realized the transition from lead to lead-free at the level of secondary packaging. Due to the characteristics of the commonly used tin-copper and tin-silver-copper solders with high melting points and easy oxidation, the existing solder wire The use of flux is basically to use the original flux system. Its characteristic is that the flux contains halogens, the residue after welding becomes hard, and even brittle cracks appear. [0003] However, with the strengthening of people's awareness of environmental protec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/363B23K35/40
Inventor 王小京张义宾陈钦刘宁陈云霞邵辉
Owner JIANGSU UNIV OF SCI & TECH
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