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Additive capable of preventing copper replacement in cyanide-free alkaline coppering solution and preparation method thereof

A cyanide-free alkaline copper plating and additive technology, applied in the field of electroplating, can solve the problems of easy replacement and precipitation of copper, poor adhesion between the copper plating layer and the substrate, etc. Effect

Inactive Publication Date: 2013-04-17
武汉吉和昌新材料股份有限公司 +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These alkaline copper plating processes all have the problem that copper on the steel substrate is easily replaced and precipitated, resulting in poor bonding between the copper plating layer and the substrate

Method used

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  • Additive capable of preventing copper replacement in cyanide-free alkaline coppering solution and preparation method thereof
  • Additive capable of preventing copper replacement in cyanide-free alkaline coppering solution and preparation method thereof
  • Additive capable of preventing copper replacement in cyanide-free alkaline coppering solution and preparation method thereof

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Embodiment Construction

[0025] The anti-displacement copper additive, preparation method and process in the preferred cyanide-free alkaline copper plating solution of the present invention will be described in detail below, but it is not a limitation of the present invention. Essential improvements and adjustments are also deemed to fall within the protection scope of the present invention.

[0026] First, the components of the anti-displacement copper additive in the cyanide-free alkaline copper plating solution of the present invention are described and selected in detail.

[0027] 1. In the alkaline bright copper plating solution, divalent copper salt (copper sulfate) and potassium hydroxide are the main components. However, copper sulfate cannot be directly added to the potassium hydroxide solution, and it will precipitate rapidly, so it is necessary to coordinate the copper salt with the complexing agent before adding it to the alkaline solution. There are many complexing agents that can coordi...

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Abstract

The invention provides an additive capable of preventing copper replacement in cyanide-free alkaline coppering solution and a preparation method thereof, and belongs to the field of electrofacing. The additive capable of preventing copper replacement in cyanide-free alkaline coppering solution, provided by the invention, is cucurbituril (CB) n for short. The addictive with required concentration is prepared through the following method: pouring 500 to 600 ml distilled water or deionized water into a 1000 ml container, adding 20 to 30g KOH, weighing and adding 1g hot cucurbituril into the solution when all KOH dissolves; and when the cucurbituril dissolves completely, refilling distilled water or deionized water to 1000 ml and stirring the solution well. The additive can solve the problem that the binding force between the copper plate and the base body is bad as the copper is replaced and separated out, and enables the binding force between the plated copper plate and the base body to be strong.

Description

technical field [0001] The invention relates to the field of electroplating, in particular to an anti-displacement copper additive in a cyanide-free alkaline copper plating solution and a preparation method thereof. Background technique [0002] The electroplated copper layer has good ductility, electrical conductivity, thermal conductivity, easy to polish, and has strong affinity and good binding force with iron and other metals. Therefore, the copper plating layer can be used as the bottom layer of pre-plating or multi-layer electroplating, saving a lot of nickel and Other precious metals are widely used in machinery, electronics, aerospace, weapons, automobiles, ships and other industrial fields. Since the current cyanide-free copper plating technology is not yet mature, there are problems such as poor bonding with iron substrates and other metal coatings, narrow current density range, low current efficiency, and non-bright coatings. Therefore, there are still a large nu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
Inventor 胡哲左正忠杨娟宋文超付远波
Owner 武汉吉和昌新材料股份有限公司
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