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Plasma apparatus for the abating emissions of per-fluoro compounds and plasma vortex reactor for making the plasma apparatus

A plasma and processing device technology, applied in the field of plasma processing devices and vortex plasma reactors, can solve the problems of destroying perfluorinated waste gas, particulate matter pollution of pipelines and downstream equipment, and the impact of wet scrubber 150 cleaning performance, etc.

Inactive Publication Date: 2013-04-10
RESI CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] This traditional approach needs to utilize the reaction in the independent reaction chamber 113 after leaving the contact of the plasma torch 112. Therefore, the plasma torch 112 must provide enough energy to maintain a high temperature (for example, 1,000° C.), and the inside of the reaction chamber 113 It must be constructed of fire-resistant and heat-insulating materials. Under the heating of the plasma torch, a high-temperature environment is formed so that the independent reaction chamber 113 can maintain the ability to destroy perfluorinated waste gas.
Moreover, after the reaction is carried out in the high-temperature independent reaction chamber 113, the water is directly cooled by the sprinkler group 120 and then washed by the wet scrubber 150. At this time, it is also necessary to provide sufficient cooling energy to cool the gas for washing; Otherwise, the scrubbing performance of the wet scrubber 150 will be greatly affected
In addition, the previous patents did not have appropriate measures to remove the droplets discharged with the perfluorinated waste gas at the outlet of the wet scrubber 150. This situation is more serious under low-pressure operating conditions, which will also cause the pipeline and downstream equipment to suffer from particulate matter Pollution troubles

Method used

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  • Plasma apparatus for the abating emissions of per-fluoro compounds and plasma vortex reactor for making the plasma apparatus
  • Plasma apparatus for the abating emissions of per-fluoro compounds and plasma vortex reactor for making the plasma apparatus
  • Plasma apparatus for the abating emissions of per-fluoro compounds and plasma vortex reactor for making the plasma apparatus

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Embodiment Construction

[0058] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0059] Such as figure 2 Shown is a preferred embodiment of the plasma processing device for perfluorinated compounds of the present invention, and its principle and operation will be described below.

[0060] The plasma processing device of perfluoride of the present invention is a kind of utilization perfluoride waste gas to inject in the vortex plasma reactor 30 with tangential line, make it generate cyclone vortex, in the vortex plasma reactor 30 interior utilize The DC plasma torch 31 at one end pyrolyzes the perfluorinated waste gas, uses the Venturi scrubber 40 and the wet scrubber 60 to wash and lower the temperature to remove acid gas and particulate matter, and then uses the foam remover 70 to entrain the airflo...

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Abstract

This invention provides a novel plasma apparatus, for the abating emissions of perfluoro compounds, which consists of a vortex plasma reactor, a venturi scrubber, a scrubber liquid sump, a packed tower scrubber, and a foam breaker. The said vortex plasma reactor has a plasma torch installed at the center of one end, and tangentially injected ports installed at the other end for the intake of flue gas containing perfluoro compounds and an amount of water for chemical reaction, to generate a highly turbulent vortex flow with high temperature gradient for enhancing the chemical reaction and destruction of the said perfluoro compounds. The flue gas from the said vortex plasma reactor is further treated by the said venturi scrubber for quenching and removal of acid gases and particulates, the said packed tower scrubber for the removal of acid gases, and the said foam breaker for the removal of entrained droplets and foams. The destruction and removal efficiency, of the said plasma apparatus for the abating emissions of PFCs, has demonstrated to reach 99.9%.

Description

technical field [0001] The present invention is related to a plasma treatment device for perfluorinated waste gas in the semiconductor industry, in particular to a perfluorinated plasma treatment device and a vortex plasma reactor applied to the plasma treatment device, which utilizes perfluorinated The compound waste gas is injected tangentially into the vortex plasma reactor to form a strong vortex, so that the perfluorinated waste gas and appropriate amount of water react with the plasma torch at high temperature to completely destroy the perfluorinated compounds in the waste gas. Then use Venturi scrubber, wet scrubber and a foam remover to remove the acid gas and granular matter produced by the reaction, so as to achieve the goal of high destruction removal efficiency. Background technique [0002] Semiconductor processes make extensive use of CF 4 、C 2 f 6 、NF 3 Per-fluorocompounds (PFC for short) are used as process gases, but only a small part of these gases are ...

Claims

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Application Information

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IPC IPC(8): B01D53/76B01D53/68
CPCY02C20/30
Inventor 张荣兴
Owner RESI CORP
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