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Intensive packaging method of LEDs

A technology of light-emitting diodes and packaging methods, which is applied in the direction of electrical components, electric solid-state devices, circuits, etc., can solve the problems of low production efficiency, packaging methods that are difficult to change mass production modes, high equipment and mold costs, and achieve production input costs. Low-cost, fast mass production and simple method

Active Publication Date: 2015-05-13
CHANGZHOU GALAXY CENTURY MICROELECTRONICS CO LTD
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  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned two packaging methods of air pressure screw dispensing method and plastic sealing vertical molding method require extremely high investment in equipment and mold costs, and because the production technology of the two methods is easily limited by a single variety, making this method It is difficult to transform the packaging method into a mass production mode, and the production efficiency is also low

Method used

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  • Intensive packaging method of LEDs
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Embodiment Construction

[0017] The present invention will be further described below with the given examples, but not limited thereto.

[0018] An intensive packaging method for LED light-emitting diodes, the substrate of several light-emitting LED chips with bonding wires regularly arranged and bonded is used as the processing object (such as figure 1 Shown); with the stencil and scraper as the processing technology equipment, and its: the steps of the packaging are:

[0019] Step a, sticking the screen plate on the substrate, and all the through holes of the screen plate correspond to the several light-emitting LED chips on the substrate one by one, and the light-emitting LED chips are higher than the upper surface of the screen plate;

[0020] Step b. Pour the transparent glue containing fluorescent powder on the screen, and then spread it evenly with a scraper. The transparent glue containing fluorescent powder is coated on the periphery of each light-emitting LED chip on the substrate, so that e...

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Abstract

The invention discloses an intensive packaging method of LEDs. With a plurality of LED substrates, provided with bonding wires, as processing objects, and a screen and a scraper as processing devices, the intensive packaging method of LEDs includes the steps of a, attaching the screen with a plurality of through holes to the substrates; b, pouring phosphor-bearing transparent glue onto the screen, evenly spreading the glue with the scraper, and taking off the screen; c, placing the substrates coated with the phosphor-bearing transparent glue in a dryer for drying; d, attaching the screen to the substrates processed in the step c, pouring the transparent glue into the screen, evenly spreading the glue with the scraper, taking off the screen; e, placing the substrates processed in the step d in the dryer for drying; and finishing packaging. The through holes are in one-to-one correspondence to a plurality of LED chips, and the LED chips are higher than the upper surface of the screen.

Description

technical field [0001] The invention relates to an intensive packaging method for LED light-emitting diodes, belonging to the technical field of semiconductor packaging. Background technique [0002] At present, the existing packaging method of LED light-emitting diodes is through the method of air pressure screw dispensing and plastic sealing vertical oil pressure molding method, and the substrates arranged with several light-emitting LED chips with bonding wires are respectively treated with fluorescent light. Powder transparent glue and transparent glue encapsulation. The above-mentioned two packaging methods of air pressure screw dispensing method and plastic sealing vertical molding method require extremely high investment in equipment and mold costs, and because the production technology of the two methods is easily limited by a single variety, making this method It is difficult to transform the packaging method into a mass production mode, and the production efficien...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/50H01L33/54
CPCH01L2224/48091H01L2224/48227
Inventor 蔡永义朱宁边红娟
Owner CHANGZHOU GALAXY CENTURY MICROELECTRONICS CO LTD
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