Single-chip packaging piece with adhesive film replacing bottom fillers and manufacture process thereof

Abstract

The invention discloses a single-chip packaging piece with an adhesive film replacing bottom fillers and manufacture process thereof. The packaging piece is mainly composed of a substrate, a nickel pad, a chip, a solder silver bump, the adhesive film and a solder ball. The nickel pad is fixedly connected onto the substrate, and the solder silver bump is fixedly connected onto the chip; the solder silver bump is coincided with a central line of the nickel pad and connected with the central line of the nickel pad in soldering mode; and the adhesive film fills the gap between the substrate and the chip and surrounds the nickel pad and the solder silver bump. The manufacture process is conducted according to the following steps: pasting the adhesive film; installing the chip and reflow soldering; reducing thickness of the back of a wafer; and placing the ball, inspecting, packaging and putting in storage. By means of the technology, packaging cost is reduced, packaging reliability is improved, and process links are reduced.

Description

[0001] technical field [0002] The invention belongs to the technical field of integrated circuit packaging, and in particular relates to a single-chip package with an adhesive film instead of underfill and a manufacturing process thereof. Background technique [0003] Flip Chip technology is not only a chip interconnection technology, but also an ideal chip bonding technology. As early as 30 years ago, IBM has developed and used this technology. But until recent years, Flip-Chip has become a frequently used packaging form in the field of high-end devices and high-density packaging. Today, the application range of Flip-Chip packaging technology is becoming wider and wider, and the packaging forms are becoming more diversified, so the requirements for Flip-Chip packaging technology are also increasing. At the same time, Flip-Chip also poses a series of new serious challenges to manufacturers, providing reliable support for packaging, assembly and testing for this complex ...

AI Technical Summary

Problems solved by technology

However, due to the limitations of traditional packaging in the past, the wafer can only be thinned to 200 μm, especially when the thickness is reduced to less than 100 μm, it is easy to warp, and the reliability of the package cannot be guaranteed.

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