Flow line process method for automatic transplanting and repairing of printed circuit boards

Abstract

The invention provides a flow line process method for automatic transplanting and repairing of printed circuit boards. Master slices and sub slices of the printed circuit board are embedded by concaves and convexes, a space for containing adhesive is reserved at each embedded part, the sub slices are embedded after dispensing adhesive and are vertically pressed down, and the adhesive overflows to fill the reserved embedded spaces to improve adhesiveness. The flow line process method for automatic transplanting and repairing of the printed circuit boards has such advantages that except the fact that the master slices and the sub slices are manually charged in batch in the end of a line and the middle of the line in the process of transplanting and repairing, the rest operations are automatically completed by a visual device instead of by manually placing the master slices and the sub slices slice by slice, adhesive tapes need not be stuck and torn, and different manufacturing devices need not be manufactured due to the fact that circuit modules of the circuit board are different.

Description

technical field [0001] The invention relates to an assembly line process method for automatic transplantation and repair of printed circuit boards, in particular to a kind of embedding between the mother chip and the sub-chip using a concave-convex platform, and a space for accommodating glue is reserved at the embedding place, after dispensing Embedded sub-chips are then vertically pressed down to allow the glue to overflow and fill the reserved embedding space to increase its adhesiveness. This is an automated circuit board transplant and repair assembly line process method. Background technique [0002] Under the fashionable requirement of light and thin electronic products, printed circuit boards carrying electronic components are becoming smaller and thinner. Therefore, in the prior art, it is also common that a printed circuit board mother sheet can be cut into dozens of sub-pieces. However, if one of the sub-chips fails, the entire mother chip will be discarded, resul...

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Problems solved by technology

[0005] Another example is the published Chinese CN1767724A invention patent application "Method for connecting PCB substrates", which discloses a method for connecting PCB substrates. Although the mother-child chip bonding in this method adopts step-type glue point bonding, it is still performed manually. Single-chip placement and fixing nails to fix the mother-daughter board

[0006] A comprehensive review of the above three published patents has the following defects: 1) If the joint method adopts a cut-off butt joint method, it cannot be separated, and a heat-resistant tape must be artificially pasted on the bottom of the joint to accept the adhesive glue injected into the gap. It is also necessary to manually remove the tape and remove the overflowing glue; 2) If the mother-child chip is fixed by the fixed pin method, the mother-child chip must be placed manually and the progressive tolerance after transplantation is extremely difficult to control manually; 3), and the PCB design hole position is almost No two pieces are the same, so PCBs of each material number must be made with appropriate perforated plate tools for inserting and fixing pin holes

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