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Manufacturing method for size-controllable wafer level glass micro-cavity

A wafer-level, glass-micro technology, applied in the direction of microstructure technology, microstructure devices, manufacturing microstructure devices, etc., can solve problems such as difficult to guarantee accuracy, difficult to measure accurately, difficult to place, etc.

Active Publication Date: 2013-03-20
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the problem with this method is that the weighing of a small amount of heat release agent is difficult to accurately quantify because the amount required for a single cavity is extremely small.
In addition, it is very difficult to place a small amount of powder, and it is difficult to ensure accuracy, so the yield is not high
In the mass production process, the high-temperature heat release agent powder is easy to pollute the ultra-clean room, thus affecting the reliability of microelectronic devices

Method used

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  • Manufacturing method for size-controllable wafer level glass micro-cavity
  • Manufacturing method for size-controllable wafer level glass micro-cavity
  • Manufacturing method for size-controllable wafer level glass micro-cavity

Examples

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Effect test

Embodiment 1

[0029] A method for preparing a size-controllable wafer-level glass microcavity, comprising the following steps:

[0030] In the first step, an array of micro-silicon grooves is etched on a silicon wafer (such as a 4-inch silicon wafer), and the micro-silicon grooves are connected by micro-channels. The silicon wafer used may be a standard thickness silicon wafer, for example a 500 micron thick silicon wafer. The depth of the micro-silicon groove is 10-300 microns, such as 15 microns, 30 microns, 60 microns, 100 microns, 150 microns, 180 microns, 200 microns, 300 microns, and the aspect ratio is usually less than 2, such as 1.5 , 1, 0.8, 0.5, 0.2, 0.1, 0.05, 0.01, the micromachining process of the pattern structure on the silicon wafer is a wet etching process, a dry inductively coupled plasma (ICP) etching process or reactive ion etching One of them, preferably a wet etching process, such as etching with a TMAH solution, the pattern can be a square or circular groove array; ...

Embodiment 2

[0037] A method for preparing a size-controllable wafer-level glass microcavity, comprising the following steps:

[0038] The first step is to etch micro-silicon grooves on a 4-inch silicon wafer. The micro-silicon grooves are connected by micro-channels. The silicon wafer used is a silicon wafer of standard thickness with a thickness of 500 microns. The depth of the micro-silicon grooves is 150 micron, micro-silicon grooves with a diameter of 2 mm square grooves. The micromachining process of the graphic structure on the silicon wafer is a wet etching process, the etching solution used is 25% TMAH solution, and the temperature is 90°C;

[0039] In the second step, a certain amount of sodium carbonate solution and calcium chloride solution (at a room temperature of 25 degrees Celsius) are quantitatively injected into the micro-silicon groove by dispensing technology, and evaporated to obtain calcium carbonate crystals. . Then add sodium carbonate solution and calcium chlorid...

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Abstract

The invention relates to the manufacturing technology of a microelectronic mechanical system and provides a manufacturing method for a size-controllable wafer level glass micro-cavity. The invention adopts the following technical scheme: the manufacturing method for the size-controllable wafer level glass micro-cavity comprises the following steps: etching on a silicon wafer to form a micro groove array; adding a sodium carbonate solution and a calcium chloride solution successively into the micro silicon groove, and steaming to finally obtain calcium carbonate; bonding a glass wafer with the silicon wafer under the vacuum condition or a certain pressure to seal the micro silicon groove; heating the bonded glass wafer and silicon wafer to be above the glass softening point temperature, thermally insulating, after glass corresponding to a sealed cavity body is formed by a positive pressure generated by gas discharged from the calcium carbonate in the micro groove, cooling to the normal temperature, and annealing; and removing the silicon wafer to obtain a wafer level spherical glass micro-cavity array. According to the manufacturing method, the content of the calcium carbonate can be accurately controlled, the glass micro-cavity with the size of ten submicrons and even submicron or the like can be manufactured, and an ultra-clean chamber is not influenced.

Description

technical field [0001] The invention relates to a micro-electromechanical system manufacturing technology, in particular to a method for preparing a size-controllable wafer-level glass microcavity. Background technique [0002] At present, glass microstructures have important applications in the fields of MEMS packaging, microfluidics and MOEMS (micro-optical electro-mechanical systems). The methods for preparing glass microcavities mainly include self-expansion method and positive pressure thermoforming method. For example, the University of California, Irvine uses self-expansion method to process glass microcavities. It requires a deep reactive ion etching process and a thickened silicon wafer, which is expensive. In addition, due to the small driving force, the adjustable range of the processed structure size is small. The applicant adopts a positive pressure thermoforming method to prepare a glass microcavity, and uses a high-temperature heat release agent powder to re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00
Inventor 尚金堂邹羽吉宇
Owner SOUTHEAST UNIV
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