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LED (Light-Emitting Diode) light-emitting element

A technology of light-emitting components and LED chips, which is applied in the direction of electrical components, electric solid-state devices, semiconductor devices, etc., and can solve problems such as the inability to quickly dissipate heat from LED chips

Inactive Publication Date: 2013-03-13
SHANGHAI DANGOO ELECTRONICS TARDING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because glass is a poor conductor of heat, it cannot effectively dissipate the heat of the LED chip quickly, so a buffer layer is needed to realize the heat dissipation of the LED chip

Method used

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  • LED (Light-Emitting Diode) light-emitting element

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Experimental program
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Embodiment Construction

[0015] Such as figure 1 As shown, the LED light-emitting component of the present invention includes an LED chip 1, a metal conductive circuit 2, an aluminum nitride (AlN) coating 3, a glass substrate 4, and the LED chip 1 and the metal conductive circuit 2 are fixed on the glass substrate 4. The connecting surface of the substrate 4 and the LED chip 1 is coated with an aluminum nitride (AlN) coating 3 , and the LED chip is coated with phosphor glue 5 .

[0016] Several LED chips 1 are connected in series and solidified on the circuit of aluminum nitride (AlN) coating 3 film. The surface of the LED chip 1 is coated with fluorescent powder to form a white light device.

[0017] The aluminum nitride (AlN) coating 3 thin film is grown on the glass substrate 4 by magnetron sputtering.

[0018] The protective layer of the fluorescent powder glue 5 coated on the outer layer of the LED chip 1 can be formed into a desired shape according to the light emitting pattern of the chip.

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Abstract

The invention relates to an LED (Light-Emitting Diode) light-emitting element. The LED light-emitting element comprises LED chips and a glass substrate, wherein the LED chips and a metal conductive circuit are fixed on the glass substrate; the connecting surfaces of the glass substrate and the LED chips are coated with aluminum nitride coatings, and the LED chips are coated with fluorescent powder adhesives; a plurality of the LED chips are connected in series and arranged on thin-film circuits of the aluminum nitride coatings in a solid-phase crystallization way; the surfaces of the LED chips are coated with fluorescent powder so that white-light devices are formed; aluminum nitride coating thin-films are grown on the glass substrate in a magnetron sputtering film-forming way; and fluorescent powder adhesive protective layers coated at the outer layers of the LED chips can be formed into needed shapes according to the light-emitting shapes of the LED chips. The LED light-emitting element disclosed by the invention increases the radiating area by coating the aluminum nitride coating thin-films as heat-conducting insulated layers on the LED chips and the glass substrate, thereby realizing optimal radiation.

Description

technical field [0001] The invention relates to an LED light-emitting component, in particular to an LED light-emitting component provided with a heat-conducting insulating layer on an LED chip and a glass substrate. Background technique [0002] LED is a light-emitting diode (LED, Lighting emitted diode), which is a solid-state light-emitting device that uses the PN junction to emit light under the action of an electric field. With the characteristics of high life / environmental protection / energy saving, it is a new green light source. [0003] LED technology is becoming more and more mature. At present, LED white light is white light produced by exciting yellow-green phosphors through blue chips and reconciling wavelengths. At present, the luminous efficiency of LEDs has exceeded most traditional light sources. Generally speaking, LED grows a PN layer and a light-emitting layer on an epitaxial wafer through MOCVD (Metal-organic Chemical Vapor Deposition), and then makes it...

Claims

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Application Information

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IPC IPC(8): H01L33/64H01L33/62H01L33/50
CPCH01L33/644H01L33/505H01L25/0753H01L2924/0002
Inventor 瞿崧文国军严华锋
Owner SHANGHAI DANGOO ELECTRONICS TARDING
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