Silicon hybrid composite coating electronic adhesive and preparation method thereof

An electronic glue, silicon hybrid technology, applied in coatings, chitin polysaccharide coatings, hyaluronic acid coatings, etc., can solve the problem of insufficient solvent resistance and mechanical strength, poor adhesion of the coating film to the substrate, and high curing temperature problem, to achieve the effect of good product stability, difficult phase separation, and strong hydrophobicity

Active Publication Date: 2015-01-07
GUANGZHOU GLORYSTAR CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the currently prepared silicone-coated electronic adhesives generally have defects such as poor film-forming properties, high curing temperature (generally 150-200°C), and poor adhesion of the coating film to the substrate, and its solvent resistance And the mechanical strength is also insufficient, so its application is limited

Method used

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  • Silicon hybrid composite coating electronic adhesive and preparation method thereof

Examples

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Comparison scheme
Effect test

Embodiment 1

[0026] A kind of silicon hybrid composite coated electronic glue, its preparation adopts following steps to carry out:

[0027] (1) Add 20 parts by weight of ethanol solution with a mass concentration of 20% to the flask in advance;

[0028] (2) Prepare tetraethyl orthosilicate solution prepared with absolute ethanol, wherein the weight part of ethyl orthosilicate is 40 parts by weight, and the weight part of absolute ethanol is 100 parts by weight, and the said ethyl orthosilicate solution is added dropwise to In the flask of step (1), after stirring for 10 minutes, the temperature was raised to 55°C;

[0029] (3) Slowly add an acid catalyst composed of hydrochloric acid and hydrofluoric acid with a mass ratio of 8:0.5 until the pH value of the mixed solution in the flask is 3.5;

[0030] (4) Add 10 parts by weight of PDMS, 2 parts by weight of methyltriethoxysilane and 1 part by weight of silane coupling agent KH560 into the flask, and continue stirring for 20 minutes;

[...

Embodiment 2

[0036] A kind of silicon hybrid composite coated electronic glue, its preparation adopts following steps to carry out:

[0037] (1) adding 40 parts by weight of ethanol solution with a mass concentration of 40% to the flask in advance;

[0038] (2) Prepare an ethyl orthosilicate solution prepared with absolute ethanol, wherein the ethyl orthosilicate solution is 60 parts by weight, and the ethyl orthosilicate solution is 100 parts by weight, and the ethyl orthosilicate solution is added dropwise to In the flask of step (1), after stirring for 10 minutes, heat up to 60°C;

[0039] (3) Slowly add an acid catalyst composed of hydrochloric acid and hydrofluoric acid with a mass ratio of 8:1 until the pH of the mixed solution in the flask is 4.5;

[0040] (4) Add 20 parts by weight of PDMS, 5 parts by weight of methyltriethoxysilane and 5 parts by weight of silane coupling agent KH560 into the flask, and continue stirring for 40 minutes;

[0041] (5) Slowly add hydrochloric acid ...

Embodiment 3

[0046] A kind of silicon hybrid composite coated electronic glue, its preparation adopts following steps to carry out:

[0047] (1) Add 30 parts by weight of ethanol solution with a mass concentration of 30% to the flask in advance;

[0048] (2) Prepare tetraethyl orthosilicate solution prepared with absolute ethanol, wherein the weight part of ethyl orthosilicate is 50 parts by weight, and the weight part of absolute ethanol is 100 parts by weight, and the said ethyl orthosilicate solution is added dropwise to In the flask of step (1), after stirring for 10 minutes, heat up to 60°C;

[0049] (3) Slowly add an acid catalyst composed of hydrochloric acid and hydrofluoric acid with a mass ratio of 8:2 until the pH value of the mixed solution in the flask is 4;

[0050] (4) Add 15 parts by weight of PDMS, 3 parts by weight of methyltriethoxysilane and 3 parts by weight of silane coupling agent KH560 into the flask, and continue stirring for 30 minutes.

[0051] (5) Slowly add h...

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Abstract

The invention provides a silicon hybrid composite coating electronic adhesive and a preparation method thereof. The preparation method comprises the following steps: under the action of acid catalysts which are respectively added in multiple steps, performing catalytic reaction on ethyl orthosilicate, PDMS (polydimethylsiloxane) and methyltriethoxysilane to form sol A; and compounding the sol A and chitosan to form the novel silicon hybrid composite coating electronic adhesive. The prepared coating electronic adhesive has favorable comprehensive properties; a coated film formed by the coating electronic adhesive has excellent hydrophobicity, favorable stain resistance and corrosion resistance, high adhesive force onto a coated substrate, high refracting index, fine mechanical property and good oxygen barrier property; and the preparation method is simple in preparation technique, easy to control in technical process and low in cost.

Description

technical field [0001] The invention relates to an organic-inorganic hybrid silicon material, in particular to a hydrophobic organic-inorganic silicon hybrid composite coating electronic glue. Background technique [0002] With the development of high-tech industries such as new materials and advanced equipment manufacturing, higher requirements are placed on the qualitative performance of integrated circuits and electronic devices. Integrated circuit components are extremely sensitive to pollutants, and surface contamination can even seriously affect the performance of components, and it is easy to cause short circuits due to dust and moisture absorption. Coating protective materials on the surface of electronic devices is a reliable solution to avoid similar problems and prolong the life of electronic devices. The material used for surface coating must have good comprehensive properties, can be well attached to the surface of the circuit board, have high insulation to avo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D183/04C09D105/08C09D7/12C08G77/06
Inventor 胡新嵩罗伟罗科丽
Owner GUANGZHOU GLORYSTAR CHEM
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