A chip packaging method and packaging structure thereof

Abstract

The invention relates to a chip packaging method, which comprises the following steps of: step 1, connecting a buffer substrate, a chip and a packaging shell into a whole body; and step 2, connecting an optical window and the structure formed in the step 1 into a sealed cavity in a sealing manner. The invention also relates to a chip packaging structure, which comprises the chip, the optical window, the packaging shell and the buffer substrate, wherein the packaging shell and the optical window form the sealed cavity, the buffer substrate is located in the sealed cavity, the chip is arranged on the upper surface of the buffer substrate, the lower surface of the buffer substrate is provided with a thin film getter, and a gap is formed between the buffer substrate and the inner wall of the packaging shell. By the chip packaging method and the chip packaging structure, disclosed by the invention, the chip packaging structure has mechanical shock resisting capability, so that the vacuum environment required by the chip can be realized, the packaging size can be reduced, and the packaging cost can be reduced.

Description

technical field [0001] The invention relates to a semiconductor packaging technology, in particular to a chip vacuum packaging technology. Background technique [0002] Infrared imaging technology is more and more widely used in industrial sensing, image monitoring, automobile industry, fire search and rescue, and even military navigation and night vision. Infrared focal plane detector manufacturing technology is the core of thermal imaging technology, and infrared focal plane array detector chip sealing packaging technology is the key link to realize infrared detector imaging. Infrared focal plane array detector chip needs to be in a sealed environment under vacuum Otherwise, the imaging function of its bolometer cannot be exerted. [0003] Generally speaking, the high-vacuum packaging technology of infrared focal plane array detectors uses a metal shell as a sealed cavity, and its typical structure is as follows: figure 1 and figure 2 As shown, the housing 2 is an open...

AI Technical Summary

Problems solved by technology

Infrared focal plane detector manufacturing technology is the core of thermal imaging technology, and infrared focal plane array detector chip sealing packaging technology is the key link to realize infrared detector imaging. Infrared focal plane array detector chip needs to be in a sealed environment under vacuum work in the middle, otherwise the imaging function of its bolometer cannot be exerted

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