High-density LED lamp structure

Abstract

The invention disclose a high-density LED lamp structure comprising LED lamp beads (1), a light distributing lampshade (2), a heat radiator (3), a fan (4), a driving circuit component (5) and a rear cover which are integrally assembled through the heat radiator (3). The center of the bottom surface of the heat radiator (3) recesses inwards to form a fan holding cavity (7), a plurality of heat radiation fins (8) uniformly distributed on the peripheral area are formed on the back of the heat radiator (3), a plurality of air ducts (9) are formed in the heat radiator (3), two end ports of the air ducts (9) are arranged on the inner wall of the fan holding cavity and the back of the heat radiator respectively, the fan is disposed in the fan holding cavity, and the LED lamp beads (1) are uniformly distributed on the bottom surface of the heat radiator and surround the peripheral area of the fan, and the light distributing lampshade (2) covers the front ends of the LED lamp beads (1). The high-density LED lamp structure has the advantages of good heat radiation performance, light and thin body.

Description

[0001] Technical field [0002] The present invention involves the field of LED lamps, especially the thin fan of high -power LED light bulbs. [0003] Background technique [0004] LED (light -emitting diode) has the advantages of high light emitting efficiency, power saving, long service life, and energy saving and environmental protection. With the continuous expansion of the application range, more requirements are put forward on the design of LED light sources. Among them, the heat dissipation problem affects LEDOne of the important issues of applications is that in order to meet the requirements of increasing control of the control, the commonly used method is to concentrate multiple power type LEDs on a lamp, which causes the heat of the lamp to increase the heat of the lamp suddenly and easily produce the accumulation.If it is not eliminated in time, it will cause the chip lighting efficiency and the acceleration of fluorescent powder to be aging, which will lead to reduc...

AI Technical Summary

Problems solved by technology

[0004] LED (light-emitting diode) has the advantages of high luminous efficiency, power saving, long service life, energy saving and environmental protection. With the continuous expansion of the application range, more requirements are put forward for the design of lamps and lanterns using LED light source. One of the important issues in the application, in order to meet the higher and higher requirements of the illuminance, the common practice now is to concentrate multiple power LEDs on one lamp, which leads to a sudden increase in the heat generation of the lamp and is prone to siltation. If it is not eliminated in time, it will lead to problems such as reduced luminous efficiency of the chip, accelerated aging of phosphors, etc., resulting in reduced performance and shortened service life. Traditional LED lamps adopt a passive heat dissipation solution, which dissipates heat through the radiation of the radiator, which cannot meet the needs of high-power LEDs. The heat dissipation needs of lamps and lanterns, for this reason, Chinese patent document CN201401764Y just discloses a kind of "high-power LED lamp structure with fan", this kind of high-power LED lamp structure with fan is characterized in that: it is provided with fan, radiator It is a tubular body with a hollow lumen, and the fan is fixed at the center of the tail end of the heat sink. Although this high-power LED lamp structure with a fan introduces the fan into the LED heat dissipation solution and improves the heat dissipation performance, on the one hand, This method of adding a fan outside the radiator leads to a complex structure of the lamp, which is not convenient for the assembly and production of the lamp, and it is difficult to ensure the reliability of the fan installation. On the other hand, this structure will increase the height of the lamp and cannot adapt to the height limit application requirements

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