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Preparation method of urea-phenol-formaldehyde resin adhesive used for E0 grade solid wood composite floorboard

A technology of solid wood composite flooring and formaldehyde resin, which is applied to floors, buildings, building structures, etc., can solve the problems of complex operation and high processing cost, and achieve the effect of simple glue making process, good reproducibility, and easy control of operation

Inactive Publication Date: 2013-01-30
INST OF CHEM IND OF FOREST PROD CHINESE ACAD OF FORESTRY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most of them are limited to the manufacture of three-ply boards, and modifiers need to be added when making glue. For multi-layer boards, the post-treatment after reducing aldehydes is generally expensive and complicated to operate.
Have not yet seen the production of phenol-modified low-cost urea-formaldehyde resin glue. 0 Grade Parquet Reports

Method used

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  • Preparation method of urea-phenol-formaldehyde resin adhesive used for E0 grade solid wood composite floorboard
  • Preparation method of urea-phenol-formaldehyde resin adhesive used for E0 grade solid wood composite floorboard

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] an E 0 The preparation method of urea-phenol-formaldehyde resin glue for solid wood composite flooring,

[0027] Step 1: Add 95.4g of phenol, 100g of the first batch of 36.5wt% formaldehyde solution, 38g of the first batch of urea, 10g of water and 0.3g of CaO into a 500ml four-necked flask, and heat up to 90°C for 40min.

[0028] The second step: add the second batch of 36.5wt% formaldehyde solution 107g, the second batch of urea 38g, gradually add 30wt% NaOH solution 15g, react at 88-90°C for 70min.

[0029] The third step: add the third batch of 36.5wt% formaldehyde solution 8g, gradually add the second batch of 30wt% NaOH solution 20g, react at 85-90°C for 60min.

[0030] Step 4: Add the third batch of urea 15g, the third batch of 30wt% NaOH solution 35g, react at 80-85°C for 35min, the viscosity is 1.6s, cool and discharge.

[0031] Test its physical and chemical properties, and the results are listed in Attached Table 1. Press poplar plywood to test the bonding ...

Embodiment 2

[0033] an E 0 The preparation method of urea-phenol-formaldehyde resin glue for solid wood composite flooring,

[0034] Step 1: Add 95.4g of phenol, 110g of the first batch of 36.5wt% formaldehyde solution, 45g of the first batch of urea, 10g of water and 0.3g of CaO into a 500ml four-neck flask, and heat up to 92°C for 40min.

[0035] The second step: add the second batch of 36.5wt% formaldehyde solution 117g, the second batch of urea 45g, gradually add 30wt% NaOH solution 15g, react at 91°C for 60min.

[0036] The third step: add the third batch of 36.5wt% formaldehyde solution 8g, gradually add the second batch of 30wt% NaOH solution 20g, react at 85-90°C for 60min.

[0037] Step 4: Add the third batch of urea 15g, the third batch of 30wt% NaOH solution 35g, react at 80-85°C for 20min, the viscosity is 1.6s, cool and discharge.

[0038] Test its physical and chemical properties, and the results are listed in Attached Table 1. Press poplar plywood to test the bonding stren...

Embodiment 3

[0041] an E 0 The preparation method of urea-phenol-formaldehyde resin glue for solid wood composite flooring,

[0042] Step 1: Add 76.8g of phenol, 90g of the first batch of 36.5wt% formaldehyde solution, 42g of the first batch of urea, 9g of water and 0.3g of CaO into a 500ml four-neck flask, and heat up to 88°C for 50min.

[0043] The second step: add the second batch of 36.5wt% formaldehyde solution 110g, the second batch of urea 42g, gradually add 30wt% KOH solution 15g, react at 89-91°C for 70min.

[0044] The third step: add the third batch of 36.5wt% formaldehyde solution 5g, gradually add the second batch of 30wt% KOH solution 20g, react at 85-90°C for 60min.

[0045] Step 4: Add the third batch of urea 12g, the third batch of 30wt% KOH solution 35g, react at 80-85°C for 10min, the viscosity is 1.6s, cool and discharge.

[0046] Test its physical and chemical properties, and the results are listed in Attached Table 1. Press poplar plywood to test the bonding strengt...

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Abstract

The invention discloses a preparation method of a urea-phenol-formaldehyde resin adhesive used for an E0 grade solid wood composite floorboard. In the first step, a formaldehyde solution, phenol and urea are mixed, an oxide or salt of divalent metal ion is added, or an alkali metal hydroxide is added, a heating reaction is carried out, wherein, the mol ratio of formaldehyde to the total amount of phenol and urea is 0.72-0.82; in the second step, the formaldehyde solution, urea and the alkali metal hydroxide are added, the mol ratio of formaldehyde to the total amount of phenol and urea is 1.03-1.13; in the third step, the formaldehyde solution and the alkali metal hydroxide are added, and the mol ratio of formaldehyde to the total amount of phenol and urea is 1.05-1.20; and in the fourth step, urea and the alkali metal hydroxide are added, and the final mol ratio of formaldehyde to the total amount of phenol and urea is 0.95-1.03, and a reaction is carried out until the viscosity can reach the requirement. The glue storage life is greater than 30 days. The plywood strength of the solid wood composite floorboard compacted by the glue accords with an II type plywood requirement.

Description

technical field [0001] The present invention relates to an E 0 The preparation method of phenol-modified urea-formaldehyde resin glue for class II plywood, especially relates to a kind of E 0 A preparation method of low-cost urea-formaldehyde resin glue modified with 50-100% phenol of urea quality for solid wood composite flooring. Background technique [0002] In 2010, the total sales volume of flooring in my country was 397 million m 2 , of which the solid wood floor is 42.6 million m 2 , 90.7 million m of solid wood composite flooring 2 , 235 million m of laminate flooring 2 , 25.1 million m of bamboo flooring 2 . Urea-formaldehyde resin is widely used in the manufacture of laminate flooring and bamboo flooring due to its advantages such as easy availability of raw materials, low price, simple manufacturing process, and convenient use. However, UF resin glue has two major disadvantages of poor water resistance and release of formaldehyde. Formaldehyde is harmful to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G14/08C09J161/34E04F15/04
Inventor 赵临五王春鹏储富祥张伟石建军俞阳
Owner INST OF CHEM IND OF FOREST PROD CHINESE ACAD OF FORESTRY
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