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Thermally conductive molded body

A thermal conductivity and molding technology, applied in the direction of semiconductor devices, semiconductor/solid device parts, electric solid devices, etc., can solve the problems of liquid polymer viscosity increase, low flame retardancy, manufacturing difficulties, etc., to achieve oil leakage less, excellent flame retardancy, and easy production

Active Publication Date: 2016-08-03
SEKISUI POLYMATECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, although it is necessary to use a large amount of thermally conductive filler material in order to increase thermal conductivity, the liquid polymer filled with a large amount of thermally conductive filler material increases in viscosity, making manufacturing difficult
On the other hand, if a large amount of plasticizer is added to lower the viscosity, there is a problem of oil bleeding
In addition, if a low-viscosity plasticizer is selected, there will also be a problem of low flame retardancy in the case of a low-flammability thermally conductive molded product.

Method used

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Embodiment Construction

[0033] The thermally conductive molded article of the present invention is a polymer substrate composed of an olefin-based liquid resin, a plasticizer containing a specific proportion of dialkyl carbonate (Dialkyl) and a non-silicone-based oil with a flash point of 250°C or higher, A hardened body formed after hardening of a liquid mixed composition composed of a thermally conductive filler. The composition of the above materials will be described below.

[0034] Polymer substrate: Olefin-based liquid resin is used for the polymer substrate. Since the olefin-based liquid resin is a non-silicone-based polymer, contact failure due to low-molecular-weight siloxane does not occur. In addition, olefin-based liquid resins have excellent defoaming performance even in the production process of mixing thermally conductive fillers with non-silicone-based polymers, and can be adjusted to curable materials that have a relatively long pot life. Furthermore, it can also have the heat resi...

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Abstract

The invention relates to a thermal conductive forming body which contains a macromolecule substrate, a plasticizer, and thermal conductive filling materials, and can reduce the viscosity of a liquid mixed composition which is the raw material of the thermal conductive forming body, and a thermal conductive forming body which inhibits oil seepage is provided. The macromolecule substrate is a cured body of an olefin liquid resin, the plasticizer contains dialkyl carbonate and non-silicone oil with a burning point above 250 DEG C, the weight ratio of dialkyl carbonate is above 0.05 and less than 0.85 relative to the total amount of dialkyl carbonate and non-silicone oil, and the content of non-silicone oil is less than 100 parts by weight relative to 100 parts by weight of the abovementioned macromolecule substrate.

Description

technical field [0001] The present invention relates to a thermally conductive molded body that is attached to a heat-generating electronic component and used as a heat countermeasure member for dissipating heat or cooling the heat-generating electronic component. Background technique [0002] A thermally conductive molded article with high thermal conductivity can be obtained by mixing a large amount of thermally conductive filler with a low-viscosity liquid polymer to form a liquid mixed composition, and hardening the liquid mixed composition into a predetermined shape. [0003] Although it is preferable to use liquid silicone (silicone) as this liquid polymer, due to the possibility of poor contact due to low-molecular siloxane (siloxane) and the like, the market demand for replacing it with a non-silicone-based liquid polymer has changed. Get stronger. To meet such demands, JP-A-2006-312708 (Patent Document 1) describes an example of using a poly-α-olefin resin as a non...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L23/00C08L23/20C08K5/109C08K3/22C08K5/01H01L23/373
CPCH01L2924/0002
Inventor 石垣司
Owner SEKISUI POLYMATECH CO LTD
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