MEMS (micro-electromechanical systems) device and vacuum encapsulation method of wafer level thereof

Abstract

The invention relates to an MEMS (micro-electromechanical systems) device and a vacuum encapsulation method of the wafer level thereof. The device is characterized in that wafer level vacuum encapsulation is realized by adopting a silicon-silicon direct bonding technology, a low-resistance silicon wafer is adopted in a silicon structure layer (15) bonded to a silicon substrate, and is directly etched on the silicon layer to form an electrical interconnection lead wire (5); and aluminum electrode (14) is sputtered on an electrical interconnection lead wire bonding area (4) in a lead wire through hole (13) of a silicon nut cap (12). The device has the advantages that a total silicon structure is adopted, and no residual stress exits after bonding, so that the working performance of the device can be greatly improved; low-resistance silicon is utilized as an electrode lead wire, so that damage of high temperature to a metal electrode in the silicon-silicon direct bonding process can be avoided; and the silicon-silicon direct bonding air tightness is extremely good, so that the encapsulation cost is greatly reduced. The method is high in accordance and reliability, and the process is easily implemented.

Description

technical field [0001] The invention belongs to the field of micro-electromechanical technology, in particular to a MEMS device based on silicon-silicon bonding technology and a vacuum packaging method thereof. Background technique [0002] Micro Electro-Mechanical Systems (MEMS) is based on microelectronics, micromechanics and material science to research, design and manufacture micro devices with specific functions, including micro sensors, micro actuators, etc. MEMS devices have volume Small size, light weight, low power consumption, mass production and many other advantages. [0003] Usually MEMS devices are composed of some movable structures, which are very fragile, fragile, and easily damaged by dust, water vapor, etc. In order not to affect subsequent processing and assembly, they need to be packaged at wafer level to provide good Mechanical support and environmental protection and other functions. In addition, many MEMS devices with important applications require ...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problems of poor airtightness and difficulty in electrical interconnection of MEMS device wafer-level vacuum packaging, and propose a method for wafer-level vacuum packaging of MEMS devices. This method is simple, feasible, and easy to implement.

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