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Chip inductance element manufactured by low-temperature co-firing ferrite unsintered tape

A ferrite raw material, low-temperature co-firing technology, applied in the field of chip inductors and chip inductors, can solve the problem of high Curie temperature, achieve high Curie temperature, uniform distribution, and prevent device failure

Active Publication Date: 2012-12-19
JIANGSU HUAXING ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For ferrite materials, high initial magnetic permeability and high Curie temperature are required, but these two are contradictory. The existing ferrite raw materials used in the production of chip inductors on the market are difficult to maintain High initial permeability and high Curie temperature

Method used

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  • Chip inductance element manufactured by low-temperature co-firing ferrite unsintered tape
  • Chip inductance element manufactured by low-temperature co-firing ferrite unsintered tape
  • Chip inductance element manufactured by low-temperature co-firing ferrite unsintered tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] The method for making a chip inductance element from the low temperature co-fired ferrite raw tape of this embodiment includes:

[0041] Step 1: Preparation of low temperature co-fired ferrite raw tape:

[0042] 1.1. Weigh each component in the main material respectively, the main material includes: Fe 2 o 3 47-53mol%; NiO 18-25mol%; CuO 2-10mol%; ZnO 6-21mol%; 2 o 3 2-5mol%; the main material is wet-ground, dried, sieved and pre-fired, and the pre-fired ferrite powder is added with additives for secondary wet grinding to obtain pre-fired ferrite powder;

[0043] 1.2. Weigh the pre-fired ferrite powder prepared above, add solvent and dispersant and ball mill for 3-6 hours, add binder and plasticizer and ball mill for 3-6 hours, vacuum defoaming and then tape casting, After drying, a low-temperature co-fired ferrite raw tape is obtained;

[0044] Step 2: Preparation of chip inductor components:

[0045] 2.1. According to the structural design of the chip inducto...

Embodiment 2

[0064] Table 4 shows the content of each component of the specific example 2 of the present invention. Weigh the calcined ferrite powder according to the formula in Table 4, add solvent and dispersant and ball mill for 3-6 hours, add binder and plasticizer and ball mill for 3-6 hours, vacuum defoaming, tape casting, and drying to obtain The low-temperature co-fired ferrite raw tape of the present invention.

[0065] In the present invention, ring-cutting is performed on the prepared raw material tape, the temperature is raised to 450°C at 2°C / min and kept for 3 hours to remove glue, and then the temperature is raised from 450°C to 900°C for 3 hours at 2.5°C / min for sintering. During the cooling process, the temperature was controlled to drop to 250°C for 10 hours, and then cooled naturally with the furnace, and the performance of the sintered body was tested (see Table 5).

[0066]

[0067] Table 4 Contents of components in low temperature co-fired ferrite raw tape (wt%)

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Abstract

The invention provides a chip inductance element manufactured by a low-temperature co-firing ferrite unsintered tape. The chip inductance element is characterized in that the precise positioning punching is carried out on the ferrite unsintered tape; a screen printing method is adopted, and sliver paste is fully filled in through holes; sliver paste conductor patterns are printed on the unsintered tape, meanwhile, in order to prevent Ag diffusion caused by overhigh temperature in the use process of a device, a low-temperature glass protection coating is then printed on the sliver paste pattern surface, and the device failure caused by the Ag diffusion is prevented; the printed unsintered tape is sequentially placed into a tight lamination mold according to the predesigned layer number andthe sequence, and a complete multilayer base plate blank body is formed through isostatic pressing; the blank body subjected to isostatic pressing is divided into specific small blocks; the specific small blocks are put into a furnace, the temperature is raised to 450 DEG C, the heat preservation is carried out for 3 hours, the glue discharge is carried out, then, the temperature is raised to 900DEG C, and the heat insulation sintering is carried out; in the temperature reduction process, the temperature is controlled to be lowered to 250 DEG C in 10 hours, and then, the natural cooling along with the furnace is carried out; and the sliver brushed seal end of the sintered electric element is manufactured into the electrode, and the chip inductance element is obtained.

Description

[0001] This application is a divisional application, the application number of the original application: 201110224466.6, the application date: 2011-08-06, the name of the invention: a method for making a chip inductor element from a low-temperature co-fired ferrite raw material tape. technical field [0002] The invention relates to the technical field of chip inductance elements made of magnetic materials, in particular to a chip inductance element made of low-temperature co-fired ferrite raw material tape and a method for manufacturing the chip inductance element. Background technique [0003] Inductance has no resistance to DC current, but has resistance to AC current. When a direct current is passed through the inductor, only fixed magnetic lines of force appear around it, which do not change with time; but when an alternating current is passed through the coil, magnetic lines of force that change with time will appear around it. This allows the chip inductance element t...

Claims

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Application Information

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IPC IPC(8): C04B35/622C04B35/26
Inventor 徐志明余捷周洪庆吕国洪沈伟
Owner JIANGSU HUAXING ELECTRONICS CO LTD
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