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Organic silica gel used for packaging IGBT (insulated gate bipolar translator) module, and preparation method of organic silica gel

A technology of module encapsulation and silicone, which is applied in the direction of circuits, electric solid devices, semiconductor devices, etc., can solve the problems of inability to achieve transparent flame retardancy, low adhesion of substrate materials, and poor adhesion, so as to maintain automatic repairability, Good flame retardant performance and easy pouring effect

Inactive Publication Date: 2012-12-05
YANTAI DEBANG ADVANCED SILICON MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The common problems of existing silicone gels are oil seepage, oil leakage, failure to meet the requirements of transparency and flame retardancy, poor adhesion, and low adhesion to base materials, etc.

Method used

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  • Organic silica gel used for packaging IGBT (insulated gate bipolar translator) module, and preparation method of organic silica gel
  • Organic silica gel used for packaging IGBT (insulated gate bipolar translator) module, and preparation method of organic silica gel
  • Organic silica gel used for packaging IGBT (insulated gate bipolar translator) module, and preparation method of organic silica gel

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0081] Preparation of component A: Weigh double-ended vinyl polysiloxane with a viscosity of 500cps (vinyl content: 0.3wt%), such as structural formula 1, 86.7g, with a viscosity of 100cps, end and side vinyl polydimethylsiloxane Oxylkane (vinyl content 6wt%) such as structural formula 2, 6.0g, vinyl liquid MQ resin, such as molecular formula 1 (vinyl content 1.3wt%, a=1.28, b=0.02), 4.0g, γ-(methyl Acryloyloxy)propyltrimethoxysilane 3.0g, platinum-vinylsiloxane complex catalyst 0.3g, content 7000ppm, were added into the mixer in sequence, mixed and stirred evenly, and the A component was obtained;

[0082] Preparation of component B: Weigh double-ended vinylpolysiloxane with a viscosity of 100cps (vinyl content 0.7wt%), such as structural formula 1, 83.47g, vinyl liquid MQ resin, such as molecular formula 1 (vinyl content = 1.3wt%, a=1.28, b=0.02), 6.0g, polymethylhydrogensiloxane, such as structural formula 6, 10.0g, 0.5g of triaryl phosphate, 0.3g of 1-ethynyl cyclohexanol,...

Embodiment 2

[0086] Preparation of component A: Weigh double-ended vinyl polysiloxane (vinyl content 0.42wt%) with a viscosity of 500cps, such as structural formula 1, 83.6g, vinyl ring body (vinyl content 30wt%), such as structural formula 4 , 8.0g, vinyl liquid MQ resin, such as molecular formula 1 (vinyl content 3wt%, a=1.25, b=0.05), 3.0g, γ-(2,3-epoxypropoxy)propyltrimethoxy 2.0g of silane, 0.4g of platinum-vinylsiloxane complex catalyst, content of 5000ppm, were sequentially added into the mixer, mixed and stirred evenly, and the A component was obtained;

[0087] Preparation of component B: Weigh double-ended vinylpolysiloxane with a viscosity of 500cps (vinyl content 0.12wt%), such as structural formula 1, 79.9g, vinyl liquid MQ resin such as molecular formula 1 (vinyl content 3wt%) , a=1.25, b=0.05), 4.0g, terminal and side group polymethylhydrogen siloxane, such as structural formula 8, 15.0g, 1.0g triphenyl phosphate, 0.1g ethynyl cyclohexanol, add to the mixer in turn Inside, ...

Embodiment 3

[0091] Preparation of component A: Weigh double-ended vinylpolysiloxane (vinyl content: 0.1wt%) with a viscosity of 10000cps (vinyl content: 0.1wt%), such as structural formula 1, 83g of terminal and side vinylpolydimethylsiloxane with a viscosity of 2000cps (vinyl content 0.5wt%) such as structural formula 2, 5.0g, vinyl ring body (vinyl content 30wt%) such as structural formula 5, 7.0g, vinyl liquid MT resin such as molecular formula 2 (vinyl content 3.6wt%, a =1.23, b=0.07), 3.0g, 1.0g of vinyltriethoxysilane, 1.0g of complex catalyst of chloroplatinic acid and divinyltetramethyldisiloxane, content 2000ppm, add to the mixer in turn , mix and stir evenly to obtain the A component;

[0092]Preparation of component B: Weigh double-ended vinylpolysiloxane with a viscosity of 450cps (vinyl content 1.2wt%), such as structural formula 1, 85.98g, vinyl liquid MT resin such as molecular formula 2 (vinyl content 3.6wt%) , a=1.23, b=0.07), 5.0g, polymethylhydrogensiloxane, such as st...

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Abstract

The invention relates to an organic silica gel used for packaging an IGBT (insulated gate bipolar translator) module and a preparation method of the organic silica gel. The organic silica gel comprises a component A and a component B according to the weight proportion of 1:1, wherein the component A comprises the following raw materials by weight part: 94 to 99.89 parts of base material, 0.01 to 5 parts of silane coupling agent, and 0.1 to 1 part of catalyst; the component B comprises the following raw materials by weight part: 79 to 95 parts of base material, 5 to 15 parts of crosslinking agent, 0.01 to 5 parts of fire retardant and 0.1 to 1 part of inhibitor. The organic silica gel used for packaging the IGBT module has excellent optical property, high strength, low oil leakage, and fire resistance, is transparent, is solidified fast at high temperature, is capable of satisfying the long-term operating requirements under high and / or low temperature environments, and is mainly beneficial to sealing and encapsulation protection of the IGBT modules.

Description

technical field [0001] The invention relates to a silicone gel for IGBT module packaging and a preparation method thereof, belonging to the technical field of potting materials. Background technique [0002] At present, high-lead solder is used for sealing and potting protection of medium and high frequency IGBT modules, and lead-containing solder used in IGBTs accounts for 90% of lead-containing applications in ICs used. Lead-containing solder contains lead, an element harmful to humans, which is explicitly prohibited by the European Union and RoHS, so some lead-free solder must be selected to replace it. [0003] There are many types of packaging materials for IGBT modules, and there are three main types of commonly used materials: epoxy resin, silicone and polyurethane. [0004] Epoxy resin has good adhesion to hard materials, high hardness, good insulation performance and temperature resistance, and simple process, but it cannot achieve high elasticity after curing, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/04C08K5/5435C08K5/5425C08K5/548C08K5/523C08K5/521C08K5/526C08K5/05C08K5/3475C08K5/50H01L23/29
CPCH01L2924/1305H01L2924/13055H01L2224/48091H01L2224/48137H01L2224/73265H01L2924/00014H01L2924/00
Inventor 陈维张丽娅王建斌陈田安
Owner YANTAI DEBANG ADVANCED SILICON MATERIALS
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