Directional heat conduction pcb board and electronic equipment

Abstract

The invention relates to a directional heat conduction PCB (printed circuit board), comprising a first metal layer, a heat conduction dielectric layer, a second metal layer and a copper layer, wherein the copper layer and the heat conduction dielectric layer are respectively arranged on the two sides of the second metal layer, and the first metal layer is arranged on one side of the heat conduction dielectric layer relative to the second metal layer. The electronic equipment adopts the directional heat conduction PCB, and thus heat dissipation of a circuit of the whole electronic equipment is changed into a downward heat conduction manner from a conventional upward heat conduction manner; and heat conduction is uniform, and thermal resistivity is low. The invention also provides electronic equipment applying the directional heat conduction PCB.

Description

technical field [0001] The invention relates to a heat-conducting PCB board for electronic equipment, in particular to a directional heat-conducting PCB board and electronic equipment. Background technique [0002] At present, the widely used PCB boards are copper-clad / epoxy glass cloth substrates or phenolic resin glass cloth substrates, and there are also a small amount of paper-based copper-clad boards. Although these substrates have excellent electrical properties and processing properties, they have poor heat dissipation. As a heat dissipation path for high-heating components, it is almost impossible to expect the heat to be conducted by the resin of the PCB itself, but to dissipate heat from the surface of the component to the surrounding air. However, as electronic products have entered the era of component miniaturization, high-density installation, and high-heating assembly, it is not enough to rely solely on the surface of components with a very small surface area ...

AI Technical Summary

Problems solved by technology

Furthermore, since VLSI and discrete components with high heat generation performance, such as integrated chips and LEDs, have higher and higher requirements for heat dissipation performance, ordinary printed circuit boards cannot change the conventional upward heat conduction mode, and the heat conduction is uneven. Large thermal resistance coefficient

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