Manufacturing method of rigid-flexible combined circuit board

Abstract

The invention provides a manufacturing method of a rigid-flexible combined circuit board, comprising the following steps of: step 1, providing a rigid-flexible combined substrate, wherein the rigid-flexible combined substrate comprises a flexible plate layer basic film, rigid plate layer glass fiber cloth adhered to the flexible plate layer basic film, an adhesive layer arranged between the flexible plate layer basic film and the rigid plate layer glass fiber cloth, and two copper coil layers which are respectively arranged on the surface of the flexible plate layer basic film, which is far away from the surface of the rigid plate layer glass fiber cloth, and on the surface of the rigid plate layer glass fiber cloth, which is far away from the flexible plate layer basic film; step 2, drilling at a corresponding position of the rigid-flexible combined substrate and carrying out copper sinking plating on the inner wall of a drilled hole to communicate the copper foil layers at the two sides; step 3, respectively forming needed line patterns on the two copper foil layers according to the design; step 4, arranging protection layers on the surfaces of the two copper coil layers, which are provided with the line patterns, according to the requirements of a finished product of the rigid-flexible combined circuit board, so as to manufacture a rigid-flexible combined circuit board semi-finished product; and step 5, carrying out surface treatment and appearance machining on the rigid-flexible combined circuit board semi-finished product so as to manufacture the rigid-flexible combined circuit board finished product.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a method for manufacturing a soft-rigid circuit board. Background technique [0002] With the continuous advancement of technology, the functional requirements of electronic products are getting higher and higher. At the same time, the appearance is also very short, small, light and thin. For this reason, more and more circuit boards with multi-layer integrated functions are used, especially Rigid-flex boards have developed rapidly in recent years. However, there are still many problems in the production and processing of rigid-flex boards in the entire circuit board industry. The yield and performance have not made a major breakthrough. Efficient processing of rigid-flex boards has become the most difficult problem at present. [0003] The circuit board containing the conductive layer of the flexible board and the conductive layer of the rigid board is a rigid-flex board...

AI Technical Summary

Problems solved by technology

[0002] With the continuous advancement of technology, the functional requirements of electronic products are getting higher and higher. At the same time, the appearance is also very short, small, light and thin. For this reason, more and more circuit boards with multi-layer integrated functions are used, especially Rigid-flex boards have developed rapidly in recent years. However, there are still many problems in the production and processing of rigid-flex boards in the entire circuit board industry. The yield and performance have not made a major breakthrough. Efficient processing of soft and hard boards has become the most difficult problem at present

[0003] The circuit board containing the conductive layer of the flexible board and the conductive layer of the rigid board is a rigid-flex board. The traditional rigid-flex board needs to be pressed with a simple soft board layer and a hard board layer regardless of the number of layers. , even if it is a two-layer soft-hard board, the soft board and the hard board must be separated and then pressed. High-level multi-layers need to be superimposed on each layer, which is very difficult to produce, especially at the soft-hard interface. Poor strength, easy delamination and other adverse phenomena, high production costs

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