Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Multi-runner water-cooling device for computer CPU (central processing unit)

A water-cooling device and multi-channel technology, applied in computing, instruments, electrical digital data processing, etc., can solve the problems of small application range and unsuitable application occasions, and achieve the effect of large application range, small water pressure loss, and short process

Inactive Publication Date: 2012-11-21
WUXI FORMEN TECHN
View PDF15 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The current computer CPU cooling generally adopts two methods of air cooling and water cooling. With the continuous development of graphics card processing chips, the heat generated during the work process continues to increase. In order to ensure good heat dissipation performance and normal operation of the graphics card, Its air cooling must be cooled by a high-speed fan. The high-speed fan brings loud noise and vibration, which is annoying.
However, in the existing water cooling mode, the cooling effect of the water cooling module can only reduce the temperature to the ambient temperature at most, which is not suitable for applications where the ambient temperature is relatively high, and its scope of application is small

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multi-runner water-cooling device for computer CPU (central processing unit)
  • Multi-runner water-cooling device for computer CPU (central processing unit)
  • Multi-runner water-cooling device for computer CPU (central processing unit)

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0009] See figure 1 , figure 2 , image 3 , which includes an upper cover plate 1, a micro-cutting cooling plate 2, the upper end surface of the upper cover plate 1 is provided with a water outlet 3, a water inlet 4, the upper cover plate 1 is mounted on the micro-cutting cooling plate 2, the upper cover plate 1, the micro-cutting cooling plate The cavity formed by cutting the cooling plate 2 is provided with a jet splitter plate 5, the jet splitter plate 5 has four parallel flow channel notches 6, and the water inlet 4 is connected to the four parallel flow channels along the upper surface of the jet splitter plate 5. The channel notch 6, the heat dissipation area of ​​the micro-cut cooling plate 2 is below the channel notch 6, and the heat dissipation area of ​​the micro-cut cooling plate 2 is evenly distributed with parallel heat dissipation grooves 7, and the heat dissipation grooves 7 are perpendicular to the flow channel notch 6. The outer edge of the bottom of the je...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a multi-runner water-cooling device for a computer CPU (central processing unit). The device enables temperature of a heating component to be lower than the environmental temperature, can be applied to various environmental occasions and is wide in application range, quiet and free of noise. The device comprises an upper cover plate and a microdissection cooling plate, and a water outlet and a water inlet are arranged on an upper end face of the upper cover plate which is covered on the microdissection cooling plate. The device is characterized in that an injection shunt plate is arranged in a cavity formed by the upper cover plate and the microdissection cooling plate and provided with at least four parallel runner notches, and the water inlet is communicated to the parallel runner notches along an upper surface of the injection shunt plate.

Description

technical field [0001] The invention relates to the technical field of cooling of a computer CPU, in particular to a multi-channel water cooling device for a computer CPU. Background technique [0002] The current computer CPU cooling generally adopts two methods of air cooling and water cooling. With the continuous development of graphics card processing chips, the heat generated during the work process continues to increase. In order to ensure good heat dissipation performance and normal operation of the graphics card, Its air cooling must be cooled by a high-speed fan, which brings loud noise and vibration, which is annoying. However, in the existing water-cooling cooling method, the cooling effect of the water-cooling module can only reduce the temperature to the ambient temperature at most, which is not suitable for applications where the ambient temperature is relatively high, and its applicable range is small. Contents of the invention [0003] In view of the above...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/473G06F1/20
Inventor 谈士权
Owner WUXI FORMEN TECHN
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com