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Manufacturing method for soft magnetic core spiral micro-inductor

A manufacturing method and technology of spiral inductors, which are applied in the field of microelectronics, can solve problems such as increased loss of micro-inductors, decreased Q value, and deteriorated inductance performance, and achieve the effect of high graphics accuracy and good performance

Active Publication Date: 2012-11-21
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

From the perspective of application status, integrated micro-inductors in RF circuits mainly face two problems: (1) area problem
Under high frequency conditions, the leakage current and electromagnetic coupling effect of the substrate will rapidly increase the loss of the micro-inductor fabricated on the substrate, greatly reduce the Q value, and deteriorate the inductance performance.

Method used

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  • Manufacturing method for soft magnetic core spiral micro-inductor
  • Manufacturing method for soft magnetic core spiral micro-inductor
  • Manufacturing method for soft magnetic core spiral micro-inductor

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Embodiment

[0034] Based on the GaN HEMT (Gallium Nitride High Electron Mobility Transistor) MMIC manufacturing process, a soft magnetic core spiral micro-inductor is manufactured. The specific manufacturing process is as follows:

[0035] 1) Prepare the lower layer metal of the inductor: clean the substrate with deionized water, deposit 50 / 100 nm Ti / Au metal on the GaN substrate as the electroplating seed layer by using the sputtering process; Develop to obtain the lower-layer electroplated metal pattern, use the electroplating process to electroplate 2μm Au metal, use flood exposure and development to remove the remaining photoresist, and use wet etching to remove the remaining seed layer metal to obtain the lower metal of the spiral inductor;

[0036]2) Preparation of the first layer of benzocyclobutene BCB dielectric layer: Spin-coat the BCB medium using the uniform glue process, and use the conventional annealing process to cure the benzocyclobutene BCB, specifically: in the N2 atmosp...

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Abstract

The invention relates to a manufacturing method for a soft magnetic core spiral micro-inductor, which is characterized by integrating a NiFe-AlOx soft magnetic core spiral micro-inductor and comprising the following steps: 1) preparing lower-layer metal of an inductor; 2) preparing a first benzo-cyclobutene BCB dielectric layer; 3) preparing a NiFe-AlOx film; 4) preparing a second benzo-cyclobutene BCB dielectric layer; 5) preparing a benzo-cyclobutene BCB dielectric through hole; and 6) preparing upper-layer metal of the inductor. The manufacturing method has the advantages that the soft magnetic core spiral micro-inductor for an RF / MMIC (Radio Frequency / Monolithic Microwave Integrated Circuit) is prepared by integrating a soft magnetic material with an MMIC micro-inductor. Compared with the micro-inductor free from the magnetic core, the soft magnetic core spiral micro-inductor has the advantages: (1) the inductance volume is greatly increased; (2) the quality factor is certainly increased; and (3) the whole technology is compatible with the manufacturing technology of a GaAs and GaN MMIC.

Description

technical field [0001] The invention relates to a manufacturing method of a soft magnetic core spiral microinductor, which belongs to the field of microelectronic technology. Background technique [0002] In the design of radio frequency circuits, inductance devices are often used to realize various functions such as impedance matching, DC bias, phase shifting and filtering. Inductors are widely used in unit circuits such as amplifiers, oscillators, mixers and matching networks. . Integrated micro-inductors are essential passive devices for the development of small-volume, low-weight, low-cost, low-power, low-noise, and low-distortion communication terminal equipment. From the perspective of application status, integrated micro-inductors in radio frequency circuits mainly face two problems: (1) area problem. Compared with other passive components, micro-inductors occupy a huge chip area, which hinders the high integration and low cost of radio frequency integrated circuits...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01F37/00H01F41/00
Inventor 孔岑周建军李辉陈效建
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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