Led package structure and method of fabricating the same

A technology of light-emitting diodes and packaging structures, applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of light-emitting chips 13 such as poor light-emitting efficiency, luminous characteristics, and uneven thickness, and achieve optimal airtightness and high luminous efficiency. Effect

Inactive Publication Date: 2012-11-14
SILICONWARE PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the encapsulation material 16 and the phosphor layer 17 are liquid fluids, and in order to ensure that the light-transmitting film 18 can tightly seal the reflective opening 150 of the reflector 15 to prevent the encapsulation material 16 and the phosphor layer 17 from overflowing, the The fluorescent layer 17 will not fill up the reflective opening 150, and after the light-transmissive film 18 seals the light-reflective opening 150, a gap (gap) 19 will be generated between the light-transmissive film 18 and the fluorescent layer 17, causing the packaging The thickness of the material 16 or the fluorescent layer 17 is not uniform, so that the light-emitting chip 13 has poor light-emitting efficiency and light-emitting characteristics.

Method used

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  • Led package structure and method of fabricating the same
  • Led package structure and method of fabricating the same
  • Led package structure and method of fabricating the same

Examples

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Effect test

no. 1 example

[0024] see Figure 2A to Figure 2E ", which is used to illustrate the manufacturing method of the first embodiment of the light emitting diode packaging structure of the present invention.

[0025] Such as Figure 2A and Figure 2A 'As shown, firstly, a packaging unit 20 is provided, the packaging unit 20 includes a seat body 21 having a groove 210, a guide pin 22 set in the groove 210 and extending to the outside of the seat body 21, and a guide pin 22 set in the groove The light-emitting chip 23 on the bottom surface of the groove 210, the conductive element 231 electrically connecting the light-emitting chip 23 and the lead 22, and the second light-transmitting packaging material 24 filled in the groove 210 and covering the lead 22 , light emitting chip 23 and conductive element 231, such as Figure 2A As shown, the conductive element 231 is a bonding wire. Of course, the light-emitting chip 23 can also be electrically connected to the lead 22 through a bump in a flip-ch...

no. 2 example

[0032] see Figure 3A to Figure 3C , which is used to illustrate the manufacturing method of the second embodiment of the light emitting diode packaging structure of the present invention, the difference from the above is the manufacturing method of the frame structure.

[0033] Such as Figure 3A shown, providing a preceding Figure 2A ’ structure; then, seal the first light-transmitting member 25 in the groove 210, and then set the frame structure 26 on the edge of the groove 210.

[0034] Such as Figure 3B As shown, the first accommodating space 26a is filled with a first light-transmitting packaging material 27, and the volume of the first light-transmitting packaging material 27 is larger than that of the first accommodating space 26a.

[0035] Such as Figure 3C and Figure 3C ’, the second light-transmitting member 28 is combined on the frame structure 26, and the excess first light-transmitting packaging material 27 is squeezed into the second accommodating space...

no. 3 example

[0037] see Figure 4A to Figure 4C ’, which is used to illustrate the manufacturing method of the third embodiment of the light emitting diode packaging structure of the present invention, and the difference from the above lies in the manufacturing method of the frame structure.

[0038] Such as Figure 4A shown, providing the same as previously described Figure 2A 'The structure shown; then, seal the first light-transmitting member 25 in the groove 210, and then set the inner frame 261 on the first light-transmitting member 25, and the outer frame 262 is arranged in the groove 210 , the inner frame 261 has a first accommodating space 26 a , and a second accommodating space 26 b is formed between the inner frame 261 and the outer frame 262 .

[0039] Such as Figure 4B As shown, the first accommodating space 26a is filled with a first light-transmitting packaging material 27, and the volume of the first light-transmitting packaging material 27 is larger than that of the fi...

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PUM

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Abstract

An LED package structure and a method of fabricating the same. The LED package structure includes: a package unit including a submount with a cavity, and a light emitting chip disposed in the cavity; a first light-pervious element disposed in the cavity; a multi-layered dam structure concentrically disposed on the first light-pervious element or around a rim of the cavity; a first light-pervious packaging material filled in the dam structure; and a second light-pervious element that combines with the dam structure. Accordingly, the multi-layered dam structure provides an advantage of eliminating gaps and overcomes the problem resulting from the uneven thickness of the first light-pervious packaging material used in the prior technique, thereby ensuring high illumination efficiency and enhanced airtightness.

Description

technical field [0001] The invention relates to a packaging structure and a manufacturing method thereof, in particular to a packaging structure of a light-emitting diode and a manufacturing method thereof. Background technique [0002] Today's light-emitting diode (LED) packaging uses silica gel material to protect the phosphor powder, and the silica gel material has the advantages of high light transmittance and high heat resistance, so it is often used to coat phosphor powder to isolate The heat generated by the light-emitting diodes cannot effectively block the water vapor, thus causing the phosphor to fail due to contact with the water vapor. [0003] see figure 1 As shown, it is a cross-sectional view of a light-emitting diode of US Patent No. 2010 / 0163898. As shown in the figure, a substrate 11 with a circuit pattern 110 is covered with a reflection of an exposed part of the circuit pattern 110. layer (reflection layer) 12, a light emitting chip (light emitting elem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/52H01L33/00
CPCH01L33/507H01L25/0753H01L33/486H01L2933/0041H01L2224/48091H01L33/58H01L2224/48137H01L2924/00014
Inventor 赖杰隆张文麟许智昇詹长岳
Owner SILICONWARE PRECISION IND CO LTD
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