High-power LED (light emitting diode) heat radiator

Abstract

The invention belongs to the technical field of high heat flux density electronic elements and relates to a high-power LED (light emitting diode) heat radiator, wherein an outer wall of a cylindrical heat conduction cavity is fixedly connected with 4-16 ring-shaped fins; one divergent oscillating-flow heat pipe is coaxially and fixedly connected to each fin; a heating section of the divergent oscillating-flow heat pipe is arranged in a cavity body of the heat conduction cavity after passing through the outer wall of the heat conduction cavity; the divergent oscillating-flow heat pipe is fixedly and hermetically connected with the outer wall of the heat conduction cavity; a round LED base is coaxially and fixedly connected to the lower end face of the heat conduction cavity; an LED chip is fixedly connected to the centre of the LED base; a sealed container is used as the heat conduction cavity, and heat conduction media are filled in the heat conduction cavity. With the adoption of the united running of the divergent oscillating-flow heat pipe and the heat conduction cavity filled with low boiling-point heat conduction medium or heat conduction oil, heat generated by the LED is released in time, so that the heat radiator is an efficient, portable and beautiful high-power LED heat radiator which is suitable for the radiation of high heat flux density electronic elements and particularly suitable for the heat radiation of high-power LEDs.

Description

technical field [0001] The invention belongs to the technical field of high heat flux electronic components, in particular to a high-power LED radiator. Background technique [0002] LED (Light Emitting Diode, Light Emitting Diode), as a new light-emitting element, is being vigorously advocated and promoted at home and abroad due to its advantages such as energy saving, environmental protection, high brightness, and low heat. The surface temperature of the LED will continue to rise with the accumulation of heat generated during work, especially for high-power LEDs, the problem of heat dissipation is particularly important. If the heat generated cannot be taken away in time, it will affect its luminous efficiency and accelerate the speed of the chip. Aging shortens its service life. At present, high-power LED products on the market usually adopt the method of adding fins on the substrate to dissipate heat. With the increase of LED power, the size of the heat dissipation devi...

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Problems solved by technology

[0006] The purpose of the present invention is to solve the problems of high processing difficulty, large size, and insufficient heat dissipation of the LED radiator described in the background technology, and provide a high-power LED heat dissipation by using a heat conduction cavity filled with heat conduction oil to obtain heat, and using an oscillating flow heat pipe to dissipate heat The device is characterized in that 4 to 16 annular fins 2 are fixed horizontally on the outer wall of the cylindrical heat conduction cavity 1, and a divergent oscillating flow heat pipe 3 is fixed coaxially on each fin 2, and the fins There is a wire hole 4 on the sheet 2, and the wire holes 4 on all the fins 2 are on the same vertical line, and the heating section of the divergent oscillating flow heat pipe 3 passes through the outer wall of the heat conduction cavity 1 and is placed in the cavity of the heat conduction cavity 1 , the divergent oscillating flow heat pipe 3 is sealed and fixed to the outer wall of the heat conduction chamber 1, the outer diameter of the divergent oscillating flow heat pipe 3 is smaller than the outer diameter of the fin 2, and the hook base 6 is coaxially fixed to the heat conduction chamber 1 in the heat conduction chamber 1 The top of the top, the rotating hook 5 is connected to the top surface of the hook base 6, the circular LED base 7 is coaxially fixed on the lower end surface of the heat conduction cavity 1, and the LED chip 8 is fixed on the center of the LED base 7. The heat conduction medium is filled in the heat conduction chamber 1;

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