Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Organic semiconductor device by using alkali metal rubidium compound as buffer layer or electron injection layer

A technology of organic semiconductor and electron injection layer, which is applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., can solve the problems of evaporation temperature increase process, unfavorable industrial production, and negative impact on devices, so as to improve injection and transport, balance of electron and hole numbers, effects of increased number of electrons

Inactive Publication Date: 2012-10-03
JILIN UNIV
View PDF3 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, Li and Cs compounds have been widely used as electrode buffer layers or N-type electrical dopant materials. Early Li compounds such as LiF were widely used, but due to the relatively small atomic size of Li, it is easy to diffuse into the light emission of organic light-emitting devices. The region affects the performance of the device, so compounds with larger atomic size such as Cs 2 CO 3 It was gradually applied later, but due to the high evaporation temperature of most Li and Cs compounds, such as LiF and Cs 2 CO 3 The vapor deposition temperature reaches above 600 degrees Celsius, too high vapor deposition temperature increases the process, and the high temperature process will have a negative impact on the device, which is not conducive to industrial production

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Organic semiconductor device by using alkali metal rubidium compound as buffer layer or electron injection layer
  • Organic semiconductor device by using alkali metal rubidium compound as buffer layer or electron injection layer
  • Organic semiconductor device by using alkali metal rubidium compound as buffer layer or electron injection layer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Example 1: Preparation of bottom-emission organic light-emitting devices

[0020] The process of the present invention for making bottom-emitting organic light-emitting devices: first, clean the ITO glass, then dry it, and then treat it with ultraviolet light for 10 minutes, transfer the ITO substrate to a vacuum evaporation system, and when the vacuum degree reaches 4×10 -4 Pa, the evaporation of the organic layer (including the hole transport layer 3 and the electron transport and light-emitting layer 4, and / or the hole injection layer), the cathode buffer layer (or the organic / Rb doped layer) is carried out, and finally the device is taken out An aluminum electrode is evaporated on it, and the performance of the device is tested after the above-mentioned process is completed.

[0021] In this embodiment, the Rb compound material is introduced into the organic light-emitting device as the cathode buffer layer (or doped layer) material to improve the electron injection...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the technical field of a semiconductor device, and particularly relates to an organic semiconductor device by using alkali metal rubidium compound as a buffer layer or an electron injection layer. The alkali metal rubidium compound adopts RbBr, Rb2CO3, Rb2SO4, RbOH, RbNO3, RbClO4, RbCl, RbI, RbF and the like. According to the organic semiconductor device by using the alkali metal rubidium compound as the buffer layer or the electron injection layer, disclosed by the invention, Rb compound is formed into a single cathode buffer layer or is together mixed with an organic material in the organic layer and the cathode of the semiconductor device, thus the electron injection and transmission of the organic semiconductor device can be effectively enhanced, and the performances of the organic semiconductor device can be increased further.

Description

technical field [0001] The invention belongs to the technical field of organic semiconductor devices, and in particular relates to an organic semiconductor device using an alkali metal rubidium compound as a cathode buffer layer material or an electron injection layer doping material. Background technique [0002] In organic semiconductor devices, because the electron injection barrier between the semiconductor material and the electrode is too large, it is difficult to inject electrons from the electrode into the semiconductor device in the semiconductor device, and the conductivity of the organic electron transport material is relatively low, so it is difficult to combine with Metal electrodes create ohmic contacts, which makes it difficult to improve the performance of organic semiconductor devices. [0003] Taking Organic Light-Emitting Device (OLED) as an example, OLED has become a popular technology due to its advantages of all solid state, active light emission, high ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/10H01L51/52H01L51/44
CPCY02E10/549
Inventor 李传南张健崔国宇高志杨刘川赵毅
Owner JILIN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products