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Solvent acrylic ester heat dissipation coating, and preparation method and application thereof

An acrylate and heat-dissipating paint technology, applied in lighting and heating equipment, coatings, cooling/heating devices for lighting devices, etc., can solve the problems of affecting heat dissipation effect, high cost, affecting heat dissipation effect, etc. and heat dissipation efficiency, high heat dissipation effect

Active Publication Date: 2014-07-16
HISENSE VISUAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For example, the heat dissipation coatings disclosed in patent applications ZL 200810146607.5, ZL 200510056010.8, and CN 200610080211.6 all directly mix heat dissipation powder and polymer. "It is difficult to disperse evenly in the polymer, which affects the heat dissipation effect, and the particle diameter is too large, which will affect the heat dissipation effect
[0005] Patent application CN 200510064896.0 mentions a method of depositing a carbon layer on a metal surface to manufacture a heat dissipation coating. The disadvantage is that special processing equipment is required and the cost is very high.

Method used

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  • Solvent acrylic ester heat dissipation coating, and preparation method and application thereof
  • Solvent acrylic ester heat dissipation coating, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] 0.1g of azobisisobutyronitrile and 20g of butyl acetate were formulated as an initiator solution, and 3g of multi-walled carbon nanotubes (diameter 40nm, length 600nm) with a carboxyl content of 0.5% and 15g of carbon fibers (with a carboxyl content of 0.02% The pitch-based carbon fiber with a diameter of 7000nm and a length of 5000nm), 5g of styrene, 4.5g of acrylic acid, 65g of n-butyl acrylate, and 200g of butyl acetate were prepared into a monomer solution;

[0059] In the reactor with material mixing function and temperature control function, the temperature of the monomer solution was raised to 85°C, and the initiator solution was added dropwise to the monomer solution in 4 times to carry out the polymerization reaction. The time for each drop was 15 minutes. After the addition, the reaction was continued for 1 hour. When all the initiator solution was added to the polymerization system, the reaction was continued for 1 hour, and the synthesis reaction was complete...

Embodiment 2

[0065] 0.15g of azobisisobutyronitrile and 40g of ethyl acetate were prepared as an initiator solution, and 5g of hexagonal boron nitride (diameter 200-500nm) and 16g of carbon fiber (carboxylated pitch-based carbon fiber with a carboxyl content of 0.04% and a diameter of 7000nm , length 5000nm), 7.5g styrene, 5g methyl methacrylate, 80g 2-ethylhexyl acrylate, 220g ethyl acetate to prepare monomer solution;

[0066] In the reactor with material mixing function and temperature control function, the temperature of the monomer solution was raised to 75°C, and the initiator solution was added dropwise to the monomer solution in 4 times to carry out the polymerization reaction. The time for each drop was 15 minutes. After the addition, the reaction was continued for 1 hour. When all the initiator solution was added to the polymerization system, the reaction was continued for 1 hour, and the synthesis reaction was completed to obtain a coating solution.

[0067] Spray the coating so...

Embodiment 3

[0071] 0.1g of azobisisobutyronitrile and 20g of butyl acetate were formulated as an initiator solution, and 1.5g of multi-walled carbon nanotubes (diameter 40nm, length 600nm) with a carboxyl content of 0.7% and 13.5g of carbon fibers (a carboxyl content of 0.02 % carboxylated pitch-based carbon fiber, diameter 7000nm, length 5000nm), 9g styrene, 2g acrylic acid, 65g n-butyl acrylate, 20g acrylate-2-ethylhexyl, 280g ethyl acetate are mixed with monomer solution;

[0072] In the reactor with material mixing function and temperature control function, the temperature of the monomer solution is raised to 76 ° C, and the initiator solution is added dropwise to the monomer solution for polymerization reaction in 3 times, and the time of each drop is 15 minutes. After the addition, the reaction was continued for 1 hour. After all the thermal initiator solution was added to the polymerization system, the reaction was continued for 1 hour, and the synthesis reaction was completed to ob...

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Abstract

The invention provides a solvent acrylic ester heat dissipation coating. The solvent acrylic ester heat dissipation coating is formed by first enabling a coolant to be scattered in monomer solution and then performing in situ polymerization, the weight ratio between the coolant and a monomer is (1-4):(6-9), the coolant is composed of 70-90% of carbon fiber and 10-30% of nano material, and the monomer is one or more of modified acrylic ester, acrylic acid or acrylic ester. Due to the fact that in situ polymerization of the solution is adopted, the evenly-scattered heat dissipation coating in which the carbon fiber and nano material composite heat dissipation particles are added is obtained, heat transfer and heat dissipation efficiency can be improved, the heat dissipation coating is coated on the surface of a back plate of a light-emitting diode (LED) liquid crystal module, part of heat generated by an LED is dissipated in an infrared radiation mode, the heat dissipation performance of the LED liquid crystal module is improved, the heat dissipation amount is increased on the same heat dissipation area, and the heat dissipation efficiency is improved.

Description

technical field [0001] The invention relates to a heat-dissipating paint, in particular to a solvent-type acrylate heat-dissipating paint, its preparation method and its application. Background technique [0002] At present, with the rapid development of microelectronics technology and assembly technology, modern electronic equipment is increasingly becoming a highly integrated system formed by high-density assembly and micro-assembly. The heat flux density of electronic equipment is also increasing, and its life is directly related to its operating temperature. The temperature gradient during use will generate thermal stress and thermal deformation, which will eventually lead to product fatigue failure. It can be seen that improper heat dissipation design is an important reason for the failure of modern electronic products. Therefore, some heat-dissipating materials are used in electrical and electronic components such as displays or integrated circuits in order to prevent...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F222/18C09D133/02C09D133/08C09D7/12C09D5/00C08F220/14C08F212/08C08K9/00C08K7/06C08K7/00C08K3/38F21Y101/02F21V29/87F21Y115/10
Inventor 邢哲曹建伟乔明胜李炜
Owner HISENSE VISUAL TECH CO LTD
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