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Silicon strain foil metallic packaging sensor

A silicon strain gauge, metal packaging technology, applied in instruments, measuring devices, measuring forces, etc., can solve the problems of long vacuuming time, inappropriate high temperature and high pressure, complex manufacturing process, etc., achieve high sensitivity coefficient, improve test accuracy, The effect of simple manufacturing process

Inactive Publication Date: 2012-09-12
无锡永阳电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the long vacuuming time of the vacuum potting process and the need for oil injection, the entire manufacturing process is more complicated, and it is not suitable for high temperature and high pressure

Method used

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  • Silicon strain foil metallic packaging sensor
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Embodiment Construction

[0010] The best embodiment of the present invention will be described in detail below in conjunction with specific drawings.

[0011] Such as figure 1 As shown, the silicon strain gauge metal package sensor of the present invention includes a metal cylinder 2, a pressure port 1 is arranged at the lower end of the metal cylinder 2, and a plastic socket 5 is arranged above the metal cylinder 2, and the pressure port 1 and the plastic socket 5 are respectively connected with the metal cylinder 2. The two cylinders are connected in a sealed shape. In this embodiment, the upper end of the metal cylinder 2 has inner crimping, and the lower end of the plastic socket 5 has outer crimping, and the metal cylinder 2 and the plastic socket 5 are tightly connected together through inner and outer crimping; the pressure port 1 and metal cylinder 2 are connected together by welding. The pressure port 1 has an inner cavity with an open lower end, the inner cavity communicates with the openi...

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Abstract

The invention relates to a silicon strain foil metallic packaging sensor sensing pressure output through a silicon strain foil. The sensor comprises a metal barrel. A plastic socket and a pressure port are respectively arranged at the upper end and the lower end. An inner cavity is arranged in the pressure port, the lower end of the pressure port is opened, and the upper end of the pressure port is closed to form an elastic diaphragm. A plurality of metal contact pins are arranged on the plastic socket, and the lower ends of the metal contact pins penetrate into the metal barrel. The silicon strain foil metallic packaging sensor is characterized in that the silicon strain foil is bonded to the upper portion of the elastic diaphragm, a first circuit board is arranged above the pressure port, and the first circuit board is connected with the silicon strain foil through a lead to form a bridge circuit. A second circuit board is arranged above the first circuit board, and the second circuit board and the first circuit board are welded through welding points. The second circuit board is connected with the metal contact pins into a series connection circuit through a flexible circuit board. The sensor is high in working efficiency and measuring accuracy. The silicon strain foil metallic packaging sensor does not require to be vacuumized, does not require oil injection and is simple in manufacture process.

Description

technical field [0001] The invention relates to a metal-encapsulated sensor, in particular to a metal-encapsulated sensor of a silicon strain gauge through which pressure is sensed and output by a silicon strain gauge. Background technique [0002] Early metal-encapsulated sensors used resistance strain gauges to realize pressure sensing, and resistance strain gauges were made by mechanical processing and chemical corrosion. Its disadvantages are low sensitivity coefficient of resistance, large temperature coefficient, large nonlinearity and dispersion. The test accuracy of the metal-encapsulated sensor is greatly limited. The metal-encapsulated sensor made by the vacuum potting process that appeared later overcomes the above-mentioned shortcomings, but this metal-encapsulated sensor needs to be filled with silicone oil in the vacuum cavity, based on the incompressibility of silicone oil at low pressure. The carrier that transmits the pressure, transmits the pressure to the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/22
Inventor 朱荣惠田吉成
Owner 无锡永阳电子科技有限公司
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