Preparation method of multilayer transparent conductive thin film as well as prepared thin film and application thereof
A transparent conductive film and powder technology, which is applied in coating, metal material coating process, vacuum evaporation plating, etc., can solve the problems of high cost and difficulty in obtaining low-resistivity SZO film, and achieve easy control and film adhesion Good performance and low resistance effect
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[0017] see figure 1 , showing a method for preparing a multilayer transparent conductive film according to an embodiment of the present invention, which includes the following steps:
[0018] S01: SiO 2 Powder and ZnO powder are mixed and sintered as SZO target material, the SiO 2 The mass ratio of the powder to the ZnO powder is 1 / 199-1 / 9;
[0019] S02: Provide CuSn target material, wherein the mass ratio of Cu to Sn is 7 / 3~19 / 1;
[0020] S03: Put the SZO target material and the CuSn target material into the magnetron sputtering chamber, alternately sputter the SZO layer and the CuSn layer on the substrate to obtain a sandwich structure SZO-CuSn-SZO transparent conductive film.
[0021] In step S01, the SiO 2 Mix the powder and ZnO powder evenly, and sinter, for example, at a temperature of 900° C. to 1350° C. to obtain an SZO ceramic target. Preferably, the sintering temperature is 1200°C. SiO 2 The mass ratio to ZnO is preferably 1 / 120 to 1 / 20, more preferably, SiO ...
Embodiment 1
[0029] Choose SiO2 2 :ZnO=1:49 (mass ratio) powder, after uniform mixing, sintered at a high temperature of 1250°C to form a Φ60×2mm ceramic target, and a custom-made CuSn target (the mass ratio of Cu and Sn is 9 / 1, Φ60× 2mm) together into the vacuum chamber. Then, the quartz substrate was ultrasonically cleaned with acetone, absolute ethanol and deionized water, dried with high-purity nitrogen, and placed in a vacuum chamber. The distance between the target and the substrate was set to 50mm. Use a mechanical pump and a molecular pump to evacuate the cavity to 6.0×10 -4 Pa, the argon gas of 20 sccm is introduced, and the pressure is adjusted to 1.0 Pa. The sputtering power of the SZO target is 100W, and the sputtering power of the CuSn target is 60W. The thickness of the three layers of the obtained SZO-CuSn-SZO film is 60nm, 15nm, 60nm respectively, the sheet resistance is 10Ω / □, and the average transmittance of visible light is 85%.
Embodiment 2
[0031] Choose SiO2 2:ZnO=1:49 (mass ratio) powder, after uniform mixing, sintered at a high temperature of 1250°C to form a Φ60×2mm ceramic target, and a custom-made CuSn target (the mass ratio of Cu and Sn is 9 / 1, Φ60× 2mm) together into the vacuum chamber. Then, the quartz substrate was ultrasonically cleaned with acetone, absolute ethanol and deionized water, dried with high-purity nitrogen, and placed in a vacuum chamber. The distance between the target and the substrate was set to 50mm. Use a mechanical pump and a molecular pump to evacuate the cavity to 6.0×10 -4 Pa, the argon gas of 20 sccm is introduced, and the pressure is adjusted to 1.0 Pa. The sputtering power of the SZO target is 100W, and the sputtering power of the CuSn target is 60W. The thickness of the three layers of the obtained SZO-CuSn-SZO film is 70nm, 5nm and 80nm respectively, the sheet resistance is 450Ω / □, and the average transmittance of visible light is 93%.
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