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Epoxy resin composition

A technology of epoxy resin and epoxy compound, which is applied in the direction of electrical components, circuits, transportation and packaging, and can solve the problems of inability to ensure storage stability at low temperature

Active Publication Date: 2012-08-08
NAGASE CHEMTEX CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the other hand, it only has a curing acceleration effect, and often cannot ensure storage stability at low temperatures

Method used

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  • Epoxy resin composition
  • Epoxy resin composition
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] The purpose of embodiments 1 to 5 and comparative examples 1 to 4 is to use two kinds of epoxy compounds (bisphenol F (recorded as double F in the table) and bisphenol A (recorded as double A in the table)) and two kinds of aromatic Combination of amine curing agent (diethyldiaminotoluene (recorded as EKW in the table) and bis(4-amino-3-ethylphenyl) methane) (recorded as KHAA in the table)), verify magnesium acetylacetonate ( II) (Compounds in which R1 and R2 are methyl groups, R3 is a hydrogen atom, and n is 2 in the above formula (3). The same applies to Examples and Comparative Examples). Comparative Examples 1 to 4 are systems without a curing accelerator, and Example 1 uses 3 parts by weight of magnesium acetylacetonate (II) (recorded as Mg(II)AcAc in the table), and Examples 2 to 5 use 3 parts by weight of acetylacetonate Magnesium (II) acetone hydrate (recorded as Mg(II)AcAc·2H in the table 2 O). The compositions of Examples 1-5 and Comparative Examples 1-4 are...

Embodiment 6～12

[0076] For the epoxy resin composition obtained by changing the addition amount of magnesium acetylacetonate (II) of 100 parts by weight of EXA-830LVP (described as double F in the table), 30 parts by weight of EKW, and curing accelerator , The stability, acceleration and the Tg measurement results of the cured product after curing at 160°C for 90 minutes are listed in Table 2. The evaluation method is the same as that of Examples 1-5.

[0077] [Table 2]

[0078]

[0079] From the results in Table 2, even if magnesium (II) acetylacetonate was added in a small amount of 0.1 parts by weight, the curing acceleration effect was observed, and stability was also observed when it was added up to 15 parts by weight. The preferred addition amount is considered to be between 0.4 and 10 parts by weight.

Embodiment 13～15

[0081] As a curing accelerator, manganese (III) acetylacetonate (represented as Mn(AcAc)3 in the table), manganese (II) acetylacetonate ( It is described as Mn(AcAc)2 in the table), and cobalt(III) acetylacetonate (described as Co(AcAc)3 in the table). Stability, acceleration and Tg of the epoxy resin composition which consists of 100 weight part of EXA-830LVP (it describes as double F in a table|surface) and 30 weight part of EKW were measured similarly to Examples 1-5. The results are listed in Table 3.

[0082] [table 3]

[0083]

[0084] As shown in the results in Table 3, magnesium (II) acetylacetonate can be used as the main curing accelerator and other metal acetylacetonates can be used in combination.

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PUM

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Abstract

A low-temperature curable epoxy resin composition which comprises: an epoxy component that contains an epoxy compound having at least two epoxy groups in one molecule and that is liquid at 25 DEG C; an aromatic-amine based curing agent that contains an aromatic amine compound having, in one molecule, at least two amino groups bonded directly to the aromatic ring and that is liquid at 25 DEG C; and a cure accelerator consisting of Mg(II) acetylacetonate. The composition contains a novel cure accelerator using a metal complex, so that the composition exhibits high stability at room temperature and permits reduction in the temperature and time of curing.

Description

technical field [0001] The present invention relates to an aromatic amine curable epoxy resin composition, which contains a curing accelerator and can be cured at low temperature for a short time. Background technique [0002] Epoxy resin compositions containing epoxy compounds and aromatic amine curing agents show strong adhesion to various surfaces after thermal curing, and possess excellent mechanical, physical, and electrical properties through chemical bonds generated by curing It has chemical stability and thermal stability compared with the chemical bond formed by curing the widely used acid anhydride-curable epoxy resin composition. Moreover, it also has the special advantage of being able to change the glass transition temperature of the cured product in a wide range by changing the molar ratio of epoxy group to amino group, thereby manipulating and adjusting the mechanical, physical and electrical properties, so it can be used as Adhesive materials, filler materia...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/70C08G59/50H01L23/29H01L23/31
CPCC08G59/5033H01L23/296C08G59/70H01L23/295C08L63/00H01L23/293H01L2924/0002Y10T428/31511H01L2924/00
Inventor 水池克行矶部友基篠原真
Owner NAGASE CHEMTEX CORPORATION
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