Package carrier and manufacturing method thereof

Abstract

A manufacturing method of a package carrier is provided. A first opening communicating an upper surface and a lower surface of a substrate is formed. A heat-conducting element having a top surface and a bottom surface is configured in the first opening and fixed into the first opening via an insulation material. A first insulation layer and a first metal layer are laminated onto the upper surface. A second insulation layer and a second metal layer are laminated onto the lower surface. A second opening and a third opening respectively exposing portions of the top and the bottom surfaces are formed. At least one through via passing through the first metal layer, the first insulation layer, the substrate, the second insulation layer and the second metal layer is formed. A third metal layer covering the first and second metal layers and an inner wall of the through via is formed.

Description

technical field [0001] The present invention relates to a semiconductor structure and its manufacturing method, and in particular to a packaging carrier and its manufacturing method. Background technique [0002] The purpose of chip packaging is to protect the bare chip, reduce the density of chip contacts and provide good heat dissipation for the chip. Traditional wire bonding technology usually uses a leadframe as a chip carrier. As the chip's contact density gradually increases, the lead frame can no longer provide a higher contact density, so it can be replaced by a package substrate with a high contact density, and through metal wires or bumps, etc. The conductive medium is used to package the chip on the packaging substrate. [0003] Taking the currently commonly used LED packaging structure as an example, the LED chip needs to be packaged before use, and the LED chip will generate a large amount of heat energy when emitting light. If the heat energy generated by th...

AI Technical Summary

Problems solved by technology

In this way, the light-emitting diode chip may cause brightness attenuation and shorten service life due to overheating, and even cause permanent damage in severe cases

[0004] As the integration of integrated circuits increases, due to the thermal expansion coefficient mismatch between the LED chip and the package substrate, thermal stress and warpage are also increasingly occurring. Serious, and this result will lead to a decrease in the reliability (reliability) between the LED chip and the packaging substrate

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