Reflow soldering system by aid of liquid nitrogen cooling and soldering method thereof

Abstract

The invention discloses a reflow soldering system and a corresponding soldering method thereof. The reflow soldering system comprises a sealed test box with the interior filled with nitrogen, a working turntable arranged in the test box, an electric heating device and a liquid nitrogen cooling device, wherein the working turntable is formed by a rotating shaft and a turntable and used for placing electronic components to be soldered and soldering fluxes, the electric heating device comprises a power supply, an electric heating element and a corresponding fan, and the liquid nitrogen cooling device comprises a self-pressurization liquid nitrogen container, a liquid nitrogen distributor, a low-temperature valve and a corresponding fan. The reflow soldering system by aid of liquid nitrogen cooling and the soldering method thereof can use nitrogen as protection gas to perform electric heating, simultaneously use liquid nitrogen to achieve cooling, and therefore technical effects including uniform soldering flux heating, soldering flux cooling and one-time massive soldering in mionectic environment are achieved.

Description

Technical field [0001] The present invention relates to the field of soldering, and more specifically, to a reflow soldering system and a corresponding soldering method. Background technique [0002] At present, large and medium-sized reflow furnaces for soldering printed circuit boards generally consist of a heating zone, a heat preservation zone, a soldering zone and a cooling zone, while small reflow soldering furnaces use a cavity to achieve heating and cooling. During the soldering process, the solder paste melts to solidify, thereby forming a finished electronic circuit. [0003] As the heating mechanism of the reflow oven, the prior art usually uses infrared heaters and hot blast heaters. Most infrared heaters use quartz tubes for infrared heating. The temperature control of this heating method is difficult. The hot air heating method has the characteristics of high heat transfer efficiency and excellent heating capacity. [0004] As a cooling method of the reflow oven, fa...

AI Technical Summary

Problems solved by technology

If the temperature of the heating zone fluctuates up and down during heating, the printed circuit board cannot be heated uniformly, partially causing overheating and insufficient heating, thereby causing thermal damage to electronic components and non-melting of solder paste

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