Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Mushroom cultivation substrate

A cultivation substrate, shiitake mushroom technology, applied in the direction of fertilizer mixture, fertilization device, application, etc., can solve problems such as death, crop production reduction, human health hazards, etc.

Inactive Publication Date: 2012-07-25
FUJIAN AGRI & FORESTRY UNIV
View PDF2 Cites 24 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Soil heavy metal pollution will lead to crop yield reduction or even death, and will also cause great harm to human health
There are no reports of heavy metal modifiers that can be effectively applied to edible fungi

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mushroom cultivation substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Embodiment one: a kind of mushroom cultivation substrate

[0019] A mushroom cultivation substrate is composed of solid materials and water, and the percentages of each solid material in the total weight of the solid materials are as follows: 80% of broad-leaved wood chips; 16% of bran; 1% of sucrose; 1% of gypsum powder; 1% of calcium magnesium phosphate fertilizer; 1% compound fertilizer; the content of water in the mushroom cultivation substrate accounts for 60% of the total weight of solid materials.

Embodiment 2

[0020] Embodiment two: a kind of mushroom cultivation substrate

[0021] A kind of mushroom culture medium, is made up of solid material and water, and the weight of each solid material is as follows: 40kg of broad-leaved wood chips, 8kg of bran, 0.5kg of sucrose, 0.5kg of gypsum powder, 0.5kg of calcium magnesium phosphate fertilizer, 0.5kg of compound fertilizer; The water content in the matrix was 30 kg.

Embodiment 3

[0023] A mushroom cultivation substrate is composed of solid materials and water, and the percentages of each solid material in the total weight of the solid materials are as follows: 79% of broad-leaved wood chips; 16.3% of bran; 1.2% of sucrose; 1.2% of gypsum powder; 1.5% of calcium magnesium phosphate fertilizer; The compound fertilizer is 0.8%; the water content in the mushroom cultivation medium accounts for 62% of the total weight of the solid material.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a mushroom cultivation substrate, which consists of solid materials and water. The mushroom cultivation substrate is characterized in that the solid materials comprise by weight 78-82% of broad-leaf tree sawdust, 14-20% of wheat bran, 0.8-1.2% of sucrose, 0.7-1.2% of gypsum powder, 0.8-1.5% of fused calcium-magnesium phosphate fertilizer, and 0.8-1.5% of a compound fertilizer, and that water in the mushroom cultivation substrate accounts for 58-62% of the total weight of the solid materials. According to the mushroom cultivation substrate, fused calcium-magnesium phosphate fertilizer and the compound fertilizer serving as mushroom heavy metal modifying agents are added in the conventional cultivation substrate of the mushroom, the addition amount of fused calcium-magnesium phosphate fertilizer and the compound fertilizer is within the range of 0.8-1.5%, so that the cadmium content in the mushroom is reduced by 18-39.6%, and the mercury content is reduced by 19.9-29%; moreover, the accumulation function of the heavy metals can be reduced to the largest degree, and the adverse effects on important agronomic characteristics such as mycelium spreading speed, yields and the like are avoided.

Description

technical field [0001] The invention relates to an edible fungus cultivation substrate, in particular to a shiitake mushroom cultivation substrate. Background technique [0002] Edible fungi is a characteristic and advantageous industry in Fujian. In 2009, the total output of edible fungi in the province was 1.9698 million tons (fresh products), an increase of 2.77%; the output value was 8.682 billion yuan, an increase of 9.52%. The output and output value of rare edible fungi in the province are 545,200 tons and 2.544 billion yuan respectively, accounting for 27.68% of the total output of edible fungi, and the output value accounts for 29.30%. new contribution. Under the background that the overall situation of the edible fungi industry in our province is good, there are still hidden dangers and problems in the safe production of edible fungi and the export of edible fungi. [0003] In view of the current situation of heavy metal pollution in soil and water, the problem o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C05G3/00
Inventor 谢宝贵鲍春熊芳朱坚邓优锦刘新锐江玉姬
Owner FUJIAN AGRI & FORESTRY UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com