Sand charging groove for manufacturing electroplated diamond fretsaw

Abstract

The invention discloses a sand charging groove for manufacturing an electroplated diamond fretsaw, which comprises a circulation groove, a lower sand charging groove and an upper sand charging groove, wherein the lower sand charging groove and the upper sand charging groove are arranged above the circulation groove in a layering way at intervals, the bottom of the lower sand charging groove and the bottom of the upper sand charging groove are respectively provided with liquid leaking plates with liquid leaking holes, a liquid charging hole communicated with the circulation groove by a liquid pipe is arranged above the upper sand charging groove, and the liquid pipe is connected with a chemical pump; and two sides of the lower sand charging groove and the upper sand charging groove are respectively provided with electric conducting rollers, and the lower sand charging groove and the upper sand charging groove are internally provided with nickel plates respectively. The sand charging groove is simple and reasonable in structure, and easy to manufacture, and the impact of the flow of plating solution on the consolidation of diamond micropowder can be avoided since a stirrer device is not needed to be arranged in the plating solution, so that the sand charging groove is high in sand charging efficiency; and the diamond fretsaw produced from the sand charging groove has the advantages of being even and compact in micropowder grain distribution, sharp to cut, high in cutting efficiency and long in service life.

Description

technical field [0001] The invention belongs to the technical field of electroplating equipment, in particular to an upper sand tank for manufacturing electroplated diamond wire saws. Background technique [0002] With the rapid development of the domestic photovoltaic industry, the demand for polysilicon and monocrystalline silicon is increasing day by day, which in turn promotes the technological innovation of the silicon wafer processing industry. The most important aspect is the innovation of silicon wafer cutting technology. In the photovoltaic power generation industry where silicon wafers are used as base cells, silicon wafer cutting accounts for about 70% of the cost. Reducing the cost of silicon wafer cutting is of great significance for grid-connected power generation in the photovoltaic industry. [0003] As a fixed abrasive wire saw, the electroplated diamond wire saw has the advantages of high cutting efficiency, high heat resistance and wear resistance compared...

AI Technical Summary

Problems solved by technology

However, in the process of stirring or blowing the plating solution, it will inevitably cause the flow of the plating solution, which will have an impact on the matrix adsorption (physical adsorption) micropowder abrasive particles, resulting in difficulties in sand fixing, and the quality of wire saw products cannot be guaranteed.

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