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Printing and bonding production line and die cutting equipment thereof

A production line and die-punching technology, applied in the field of printing lamination production line and die-cutting equipment, to achieve excellent process flexibility and product adaptability, promote large-scale batch production, and reduce labor intensity

Active Publication Date: 2012-07-18
江苏恩福赛柔性电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above process characteristics pose a huge challenge to the large-scale manufacturing of printed electronic products

Method used

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  • Printing and bonding production line and die cutting equipment thereof
  • Printing and bonding production line and die cutting equipment thereof
  • Printing and bonding production line and die cutting equipment thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] In the prior art, since printed electronic products have the characteristics of multiple levels and require accurate positioning between levels, there is currently no related equipment for mass production.

[0037] The die punching equipment of the embodiment of the present invention adopts the first raw material feeding mechanism and the second raw material feeding mechanism to feed the first strip-shaped raw material and the second strip-shaped raw material for punching and bonding, and adopts electronic identification The tracking components respectively track and locate the positioning marks on the first strip-shaped raw material and the second strip-shaped raw material, so that the die-cutting mechanism and the positioning and laminating mechanism can work at a consistent pace, which is beneficial to all levels of printed electronic products. Accurate and automatic positioning.

[0038] The printing and laminating production line of the embodiment of the present inventi...

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PUM

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Abstract

The invention provides a printing and bonding production line and die cutting equipment thereof. The printing and bonding production line comprises one or more pieces of die cutting equipment and one or more size printing machines, wherein each size printing machine comprises a size feeding mechanism controlled by a servo control mechanism; after band-shaped processing materials pass through the size feeding mechanism, electrolytes or size with specified patterns are printed on specified positions of the band-shaped processing materials; and the size feeding servo control mechanism of the size printing machine is synchronously coupled with a first servo control part or a second servo control part of one piece of die cutting equipment, and / or the first servo control part or the second servo control part of one piece of die cutting equipment is synchronously coupled with a first servo control part or a second servo control part of another piece of die cutting equipment. By adopting the printing and bonding production line and the die cutting equipment thereof, large-scale production of printed electronic products can be realized.

Description

Technical field [0001] The invention relates to production line equipment, in particular to a printing and laminating production line of printed electronic products and its die punching equipment. Background technique [0002] Printed electronic products are emerging products that include thin-film paper batteries, RFID, thin-film displays, thin-film calculators, USB flash drives, and thin-film speakers. Printed electronic products are characterized by flexibility, thinness, and convenience, as well as environmental protection and economy. Printed electronic products can be used in scenarios such as e-books, electronic newspapers, radio frequency tags, electronic packaging, electronic masks, electronic drug stickers, sensor tags, etc. The emergence of printed electronic products will affect the entire consumer electronics and industrial electronics fields (such as logistics, medical , Security, etc.) have a profound impact. [0003] Printed electronic products mostly adopt multi-...

Claims

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Application Information

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IPC IPC(8): B32B38/04B32B37/00B32B41/00
Inventor 李守军张霞昌
Owner 江苏恩福赛柔性电子有限公司
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