Method for producing outer-layer semi-pressing plate

Abstract

The invention belongs to the field of printed circuit boards and provides a method for producing an outer-layer semi-pressing plate. The method comprises first utilizing a laminator to press two layers of 50UM of thermosetting adhesive on a transparent substrate with pressure of 4kg / cm<2> at 110 DEG C after an inner-layer plate is normally manufactured according to printed circuit board (PCB) process so as to ensure adhesive content is sufficient to fill the gap between circuits without forming bubbles, then drilling holes and milling the substrate into a shape of an outer-layer cover plate required by the semi-pressing plate, and enabling the edge of the outer-layer cover plate to be neat without burrs; and finally during layer-pressing lamination, laminating craft paper, a steel plate, a rubber cushion, waste copper foil, a core plate, waste copper foil, a rubber cushion, a steel plate and craft paper in sequence, wherein the waste copper foil and the rubber cushions are added in the middle, the effects of even heat conduction and edge are achieved. The process technology of soft plates is applied to a hard plate process, the thermosetting adhesive adhesion replaces traditional polypropylene (PP) adhesion, and the problem of adhesive flowing of the PP adhesion is solved by utilizing the thermosetting adhesive.

Description

technical field [0001] The invention belongs to the field of printed circuit boards, in particular to a method for producing outer layer semi-pressed boards. Background technique [0002] The printed circuit board is a product made by supplementing lines on a copper plate using a complex processing process, and is manufactured through a series of technological means such as etching, and provides a carrier board for subsequent placement products. The main products are used in all consumer electronics, industrial control, communication, wireless communication and other fields. [0003] There are many methods in the production process, and products such as soft and hard joint boards can be produced. The traditional hard board production process has a serious problem of PCB board flow during lamination production, which affects product quality and pass rate, and increases The production cost of the PCB board. Contents of the invention [0004] The present invention provides ...

AI Technical Summary

Problems solved by technology

[0004] The present invention provides a method for producing the outer semi-pressed board, aiming to solve the hard board manufacturing process provided by the prior art. The glue flow problem is serious when the PCB board is made by pressing, which affects the quality and qualification of the product. rate, increasing the production cost of the PCB board

Images