Method for producing outer-layer semi-pressing plate

A technology of laminated boards and outer layers, which is applied in the direction of electrical components, printed circuit manufacturing, printed circuits, etc., can solve problems that affect product quality and pass rate, increase PCB board production costs, and serious glue flow problems, etc.

Inactive Publication Date: 2012-07-11
苏州艾迪亚电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention provides a method for producing the outer semi-pressed board, aiming to solve the hard board manufacturing process provided by the prior art. The glue

Method used

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  • Method for producing outer-layer semi-pressing plate
  • Method for producing outer-layer semi-pressing plate

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Embodiment Construction

[0011] In order to make the purpose, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the invention.

[0012] figure 1 The flow chart of the method for producing the outer half-ply plywood provided by the embodiment of the present invention is shown.

[0013] The method includes the following steps:

[0014] In step S101, after the inner layer board is manufactured according to the normal process of the PCB board, the thermosetting adhesive is pressed on the transparent substrate;

[0015] In step S102, the base plate is milled into the shape of the outer cover plate required by the semi-pressed plate;

[0016] In step S103, the substrates are laminated.

[0017] In the embodiment of the present inv...

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Abstract

The invention belongs to the field of printed circuit boards and provides a method for producing an outer-layer semi-pressing plate. The method comprises first utilizing a laminator to press two layers of 50UM of thermosetting adhesive on a transparent substrate with pressure of 4kg/cm<2> at 110 DEG C after an inner-layer plate is normally manufactured according to printed circuit board (PCB) process so as to ensure adhesive content is sufficient to fill the gap between circuits without forming bubbles, then drilling holes and milling the substrate into a shape of an outer-layer cover plate required by the semi-pressing plate, and enabling the edge of the outer-layer cover plate to be neat without burrs; and finally during layer-pressing lamination, laminating craft paper, a steel plate, a rubber cushion, waste copper foil, a core plate, waste copper foil, a rubber cushion, a steel plate and craft paper in sequence, wherein the waste copper foil and the rubber cushions are added in the middle, the effects of even heat conduction and edge are achieved. The process technology of soft plates is applied to a hard plate process, the thermosetting adhesive adhesion replaces traditional polypropylene (PP) adhesion, and the problem of adhesive flowing of the PP adhesion is solved by utilizing the thermosetting adhesive.

Description

technical field [0001] The invention belongs to the field of printed circuit boards, in particular to a method for producing outer layer semi-pressed boards. Background technique [0002] The printed circuit board is a product made by supplementing lines on a copper plate using a complex processing process, and is manufactured through a series of technological means such as etching, and provides a carrier board for subsequent placement products. The main products are used in all consumer electronics, industrial control, communication, wireless communication and other fields. [0003] There are many methods in the production process, and products such as soft and hard joint boards can be produced. The traditional hard board production process has a serious problem of PCB board flow during lamination production, which affects product quality and pass rate, and increases The production cost of the PCB board. Contents of the invention [0004] The present invention provides ...

Claims

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Application Information

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IPC IPC(8): H05K3/00
Inventor 沙磊吴永青胡建明赵永刚周青锋
Owner 苏州艾迪亚电子科技有限公司
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