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Free-form surface lens and method of realizing shape-preserving coating for same

A curved lens, free technology, used in semiconductor devices, electrical components, circuits, etc., can solve the problems of complexity and high cost, and achieve the effect of improving light output efficiency

Active Publication Date: 2012-07-11
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the implementation of conformal coating technology is generally more complicated. Some technologies have environmental protection and other problems, and the cost is high. Therefore, it is very important to find a coating method with simple process, low cost and uniform distribution of phosphor powder in LED packaging.

Method used

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  • Free-form surface lens and method of realizing shape-preserving coating for same
  • Free-form surface lens and method of realizing shape-preserving coating for same
  • Free-form surface lens and method of realizing shape-preserving coating for same

Examples

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example 1

[0037] see figure 2 with image 3 , what is involved in this embodiment is the LED bracket package. The structure of the LED bracket is that the copper heat sink 11 and the lead frame 9 are fixed in the molding compound 10 , and the molding compound 10 is also fixed together with the free-form surface lens 1 . The LED chip 6 is fixed at the center of the copper heat sink 11 of the LED bracket, and the gold wire 7 connects the LED chip 6 with the lead frame 9 to form a continuous circuit. The free-form surface lens 1 has a rectangular cross section. The phosphor glue in the syringe 12 is dripped into the glue injection port 13 by a glue dispenser until the phosphor glue 8 flows out from another glue injection port 13, then the glue injection process is stopped. The glue material in the phosphor glue 8 is silica gel, and the phosphor is YAG phosphor. After the phosphor powder glue 8 reaches the equilibrium state between the free-form surface lens 1 and the LED bracket, it i...

example 2

[0039] see Figure 4 , The difference between this embodiment and Example 1 is that the cross section of the free-form surface lens 1 is trapezoidal.

example 3

[0041] see Figure 5, The difference between this embodiment and Example 1 is that the cross section of the free-form surface lens 1 is a rounded rectangle.

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Abstract

The invention belongs to LED (Light Emitting Diode) packaging technologies and discloses a free-form surface lens and a method of realizing shape-preserving coating for the same. The outer surface of the free-form surface lens is a free-form surface and serves as an optical emergent face, and the inner surface of the free-form surface lens is a flat-bottomed concave groove extending towards the outer surface of the lens and serves as an optical incident face of the free-form surface lens. After the procedures of fixing an LED chip and connecting a circuit are completed, the free-form surface lens is arranged on a substrate, fluorescent powder glue is fully filled in a gap between the inner surface of the free-form surface lens and the substrate or a support, and a shape-preserving coating effect is achieved by controlling the thickness of a fluorescent powder layer through regulating the height of the concave groove. According to the free-form surface lens provided by the invention, the shape-preserving coating of the fluorescent powder layer can be realized by using the inner surface, and the controllability of light beams can be achieved by using the outer surface, so that different illumination effects can be achieved. The method disclosed by the invention has the characteristics of simple process and wide applicable range and can be applicable to packaging forms of LED support, chip on board, array, system packaging, printed circuit board packaging, silicon-substrate packaging and the like.

Description

technical field [0001] The invention belongs to the LED packaging technology, relates to a free-form surface lens in the LED packaging and controls the geometric shape of the phosphor layer in the LED packaging, and is especially used in the LED packaging to realize the conformal coating and light beam control of the phosphor layer. Methods. Background technique [0002] LED (Light Emitting Diode) is a semiconductor light-emitting device based on the principle of P-N junction electroluminescence. It has the advantages of high electro-optic conversion efficiency, long service life, environmental protection and energy saving, and small size. It is known as the 21st century green lighting source. If it can be applied to the field of traditional lighting, it will have a very significant energy-saving effect, which is of great significance in today's increasingly tense global energy sources. With the breakthrough of the third-generation semiconductor material technology represen...

Claims

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Application Information

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IPC IPC(8): H01L33/58H01L33/50
Inventor 罗小兵胡润吴步龙付星刘胜
Owner HUAZHONG UNIV OF SCI & TECH
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