Faraday shield and plasma processing equipment

Abstract

The invention provides a Faraday shield and plasma processing equipment. The Faraday shield comprises at least two shield units which are arranged side by side, wherein each shield unit comprises a plurality of shield sections which are arranged at intervals, and the shield sections in the two adjacent shield units are arranged in a staggered mode; and the shield sections are provided with blocking parts of which the orientations are opposite and which are arranged in a staggered mode, and a shield channel is formed between the blocking parts of the two shield sections which are arranged in a staggered mode. According to the Faraday shield, plasma can be reduced and even prevented from passing through the Faraday shield by the blocking parts on the shield sections.

Description

technical field [0001] The invention belongs to the field of plasma processing equipment, and relates to a Faraday shield and plasma processing equipment containing the Faraday shield. Background technique [0002] Magnetron sputtering technology is to introduce the surface of the target into a magnetic field, and use the interaction between the magnetic field and the electrons to make the electrons run in a spiral shape near the surface of the target to impact the ionization of gas molecules to generate ions, and the generated ions hit the target under the action of the electric field The target material is sputtered from the surface of the material. At the same time, the magnetic field can confine the charged particles and increase the density of the plasma, which can increase the sputtering rate. Therefore, magnetron sputtering technology is widely used in thin film deposition and etching processes. [0003] figure 1 It is a schematic structural diagram of a plasma pro...

AI Technical Summary

Problems solved by technology

[0005] Although the first Faraday shielding unit 71 and the second Faraday shielding unit 72 are staggered to prevent most of the plasma from passing through the Faraday shield, there are still some plasmas that can pass through the Faraday shield through the slit and pollute the annular dielectric window 6

Therefore, in the actual use process, the ring-shaped dielectric window 6 needs to be cleaned frequently, which not only increases the labor intensity of the workers, but also causes process interruption and reduces the production efficiency of the plasma processing equipment.

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