Copper surface gradient wetting self-assembly film and preparation method thereof
A gradient wetting, self-assembled film technology, which is applied to devices for coating liquid on surfaces, special surfaces, coatings, etc., can solve the problems of complicated preparation process and expensive raw materials, and achieve simple process flow and easy-to-obtain raw materials. , the effect of low price
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Embodiment 1
[0024] (1) Continuously ultrasonically clean the copper sheet in hydrochloric acid, acetone, ethanol, and deionized water with a molar concentration of 2mol / L for 5 minutes, then use the pretreated copper sheet as the anode, and the graphite electrode as the cathode, 0.5mol / L Potassium hydroxide solution is used as the electrolyte, the current intensity is 400mA, and the electrodeposition time is 10min, until a layer of blue Cu(OH) is deposited on the surface of the copper sheet. 2 Precursor;
[0025] (2) The copper sheet after the electrodeposition in step (1) is placed in a high temperature dehydration at 150° C. for 3.5 hours and then taken out, and a layer of black CuO is formed on the surface of the copper sheet;
[0026] (3) Adopt the self-assembly method, place the copper sheet obtained in the step (2) in the beaker, gradually add dropwise the capric acid ethanol solution with a concentration of 0.05mmol / L, and the dropping time is 10min. After rinsing with water and e...
Embodiment 2
[0029] (1) Continuously ultrasonically clean the copper sheet in hydrochloric acid, acetone, ethanol, and deionized water with a molar concentration of 2mol / L for 5 minutes, then use the pretreated copper sheet as the anode and the platinum electrode as the cathode, 1.0mol / L Potassium hydroxide solution is used as the electrolyte, the current intensity is 200mA, and the electrodeposition time is 10min, until a layer of blue Cu(OH) is deposited on the surface of the copper sheet. 2 Precursor;
[0030] (2) The copper sheet after the electrodeposition in step (1) is placed in a high temperature dehydration at 160° C. for 3.5 hours and then taken out, and a layer of black CuO is formed on the surface of the copper sheet;
[0031] (3) Adopt the self-assembly method, place the copper sheet obtained in the step (2) in the beaker, gradually add dropwise the lauric acid ethanol solution with a concentration of 0.1mmol / L, the dropping time is 10min, after the dropping, use After rinsin...
Embodiment 3
[0034] (1) Continuously ultrasonically clean the copper sheet in hydrochloric acid, acetone, ethanol, and deionized water with a molar concentration of 2mol / L for 5 minutes, then use the pretreated copper sheet as the anode and the platinum electrode as the cathode, 2.0mol / L The sodium hydroxide solution is used as the electrolyte, the current intensity is 200mA, and the electrodeposition time is 7min, until a layer of blue Cu(OH) is deposited on the surface of the copper sheet. 2 Precursor;
[0035] (2) The copper sheet after the electrodeposition in step (1) was placed in a high temperature dehydration at 170° C. for 3 hours and then taken out, and a layer of black CuO was formed on the surface of the copper sheet;
[0036] (3) Adopt the self-assembly method, place the copper sheet obtained in step (2) in the beaker, gradually add dropwise the myristic acid ethanol solution with a concentration of 0.1mmol / L, the dropping time is 10min, and use After rinsing with absolute et...
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