Lintel type dual-guide rail dual-drive stepping scanning double silicon wafer stage exchanging device and method thereof

Abstract

The invention relates to a lintel type dual-guide rail dual-drive stepping scanning double silicon wafer stage exchanging device and a method thereof, and belongs to the field of semiconductor manufacturing equipment. According to the device, the system comprises two silicon wafer stages arranged on the same base station, wherein one silicon wafer stage operates at the exposure working position, and the other silicon wafer stage operates at the pretreatment working position; the edge of the base station is provided with 4 Y-direction linear movement units and 2 X-direction linear movement units; the middle of the base station is provided with 2 lintel type linear movement units, wherein the X directions of the lintel type linear movement units are higher than the working surfaces of the silicon wafer stages; the Y-direction linear movement units can perform the movements in the X direction through the X-direction linear movement units, and can collectively perform the movements of thesilicon wafer stages in the X direction or in the Y direction with Y-direction movement sliders of the Y-direction linear movement units. According to the present invention, the torsion interference resistance of the guide rail can be enhanced, the movement deviation and the deformation deviation can be decreased or overcome, and the movement precision of the silicon wafer stage can be improved; the operation of the device of the present invention only comprises three steps so as to shorten the required double stage exchanging time, and significantly improve the production efficiency of the photoetching machine.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing equipment, and mainly relates to a lintel-type double-guide rail double-drive step-scanning double-silicon wafer stage exchanging device and method. Background technique [0002] Photolithography technology is to transfer the pattern on the mask plate to the photoresist coated on the surface of the silicon wafer by exposure method, and transfer the pattern on the photoresist to the silicon wafer by subsequent development, etching and other technologies. Lithography machine is one of the important ultra-precision system engineering equipment in lithography technology, and its overall performance plays a very important role in the whole lithography process. The main function of the silicon wafer stage is to carry the wafer under the condition of high speed and high acceleration to achieve nanoscale positioning, complete the processes of loading and unloading, pre-alignment, align...

AI Technical Summary

Problems solved by technology

In the patent CN101201555, the conveyor belt and the docking slider are used to complete the stage changing process, the movement rhythm is small, and the operation and maintenance are simple. However, the conveyor belt mechanism and the docking slider are fixed on the abutment, so there will be a large force during the stage changing process On the abutment, it has a great influence on the overall dynamic performance

In the patent CN1485694, the table-changing operation is completed by the docking of the Y-direction linear motor and the linear guide rail. However, due to the excessive gap in the middle of the abutment, a bridging device is introduced, which increases the movement rhythm and increases the time for table-changing. At the same time, the X-direction linear motor magnetically The steel part is fixed on the abutment, and the movement of the moving parts will generate a large reaction force on the abutment when the platform is changed, which in turn affects the dynamic performance of the entire system

In the patent CN101770181, the docking of the replacement unit is used to complete the work of changing the platform, but the guide device is fixed on the abutment. During the movement of changing the platform, the moving parts will generate a large reaction force on the abutment, which in turn affects the dynamic performance of the entire system.

Therefore, the current dual-platform solution needs to be improved.

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