Laser bonding method for packaging of photoelectric device

Abstract

The invention discloses a laser bonding method for packaging of a photoelectric device, which comprises the following steps of: accurately positioning and fixing elements to be welded; applying an initial clamping force to the elements to be welded to tightly bond the elements to be welded with glass sealing materials; and in the bonding process, moving and heating the glass materials by using double beam laser obtained by light splitting method, preheating the glass sealing materials by the previous laser, melting the glass sealing materials by the next laser, forming a sealing body on a glass substrate plane, and providing airtight sealing. The laser bonding method provided by the invention remarkably reduces a residual stress distribution state of the cooled glass and has an outstanding effect for improving the packaging quality and prolonging the service life of the photoelectric device. Some examples of such glass packaging body are an organic light-emitting diode (OLED) display and other optical devices. The OLED device is taken as an example for presentation in the laser bonding method.

Description

technical field [0001] The invention relates to a laser bonding method for photoelectric device packaging, which is suitable for the packaging of organic light-emitting diode (OLED) displays, solar cells and other photoelectric devices, and belongs to the technical field of photoelectric device packaging technology and equipment. Background technique [0002] Traditional OLED device encapsulation techniques include: epoxy resin encapsulation and metal bonding using inorganic fillers and / or organic fillers. Although epoxy resin encapsulation can provide effective mechanical strength, its high price limits its use, and it cannot completely protect the glass sealing body. Metal bonding cannot be used for a long time in a large temperature range due to the large difference in CTE between metal and glass. At present, the method of laser bonding glass sealing material is applied to the sealing body of OLED devices. Since the laser beam is used to move and heat the glass sealing m...

AI Technical Summary

Problems solved by technology

Although epoxy resin encapsulation can provide effective mechanical strength, it is expensive and limits its use, and it cannot completely protect the glass seal

Metal bonding cannot be used for a long time in a large temperature range due to the large difference in CTE between metal and glass

At present, the method of laser bonding glass sealing material is applied to the sealing body of OLED devices. Since the laser beam is used to move and heat the glass sealing material to melt successively to form an airtight package, the temperature field changes continuously with the movement of the heat source, and the instantaneous high temperature brings The thermal stress of the glass substrate is prone to cracks, which affects the mechanical strength of the glass sealant

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